Advanced Packaging Forum - Heterogeneous Integration


Date: Friday, June 30, 2023
Time: 13:30-16:55
Venue: Himalayas Ballroom, 6F, Jumeirah Himalayas Hotel Shanghai
Chinese and English Simultaneous Interpretation will be provided

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In the past 50 years, Moore's "law" set the stage for long-term semiconductor strategy, cost efficiency, and research & development objectives. As semiconductor node getting smaller, the pace slows, and perhaps approaches a limit to the linear shrink. The semiconductor industry is actively exploring the development of heterogeneous integration and system-in-package solutions. From SOC to SIP and Chiplet, advanced packaging continues to empower the future industry.

Yole Développement reported the global advanced packaging market in 2022 is 44.3 billion and will grow to 78.6 billion in 2028 with the CAGR over 10%.

In this year's "Advanced Packaging Forum", we will address the emerging technology of advanced packaging, heterogeneous integration, its ecosystem, and the opportunities evolving with it.

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KEY TOPICS:
  • Packaging Technology Innovations and Market Trends
  • Heterogeneous Integration Roadmap (HIR)
  • Fan-out, SiP, Chiplet
  • Testing Solution
  • Packaging Equipment and Materials Development
Agenda / 议程
   
13:30-13:40
Opening Remarks/开幕致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁、中国区总裁
   
13:40-13:45
Moderator /主持人
Dr. Huili Fu, VP of T-Head, Alibaba
符会利，阿里巴巴，平头哥副总裁
   
13:45-14:10
Heterogeneous Integration of 3D packaging
3D 封装的异质整合趋势
Dr. Yu-Po, Wang, Vice President, R&D Center, SPIL
王愉博，矽品，副总经理
   
14:10-14:35
Chiplet Technology and Design Challenges
Chiplet技术与设计挑战
Feng Ling, CEO, Xpeedic
凌峰，芯和半导体科技（上海）股份有限公司CEO
   
14:35-15:00
Equipment challenges for panel level processing
面板级工艺的设备挑战
Frank Su, Vice President, Worldwide Business Development, SEMSYSCO PG, Lam Research
苏泳桦，泛林集团SEMSYSCO产品事业部全球业务拓展，副总裁
   
15:00-15:25
The Technology Innovation of 3D Heterogeneous Integration Enables the Future of IC
三维异构集成技术创新释放芯动能
Odd Hung, SVP, ICLEAGUE TECHNOLOGY CO.,LTD.
洪齐元，芯盟科技有限公司，资深副总裁
   
15:25-15:40 Tea Break 茶歇
   
15:40-16:05
Challenges and Opportunities in Chip Testing in the Era of Chiplet and Heterogeneous Integration
异构集成和Chiplet时代下，芯片测试行业的机遇与挑战
Fisher Zhang, GM, Complex SOC BU, Asia, Teradyne
张震宇, 泰瑞达Complex SOC 事业部亚太区总经理
   
16:05-16:30
The challenges and solutions for 2.5D & 3D process
2.5D&3D的工艺挑战与对策
Qiushi Xie, Vice General Manager of The Etch Business Unit, Beijing NAURA Microelectronics Equipment Co., Ltd.
谢秋实，刻蚀事业单元副总经理，北京北方华创微电子装备有限公司
   
16:30-16:55
Laser Application and Challenges in Semiconductor Advance Heterogeneous Packaging
先进异构集成封装的激光应用和挑战
DESMOND HOR, VP of Wuxi Lead Group; VGM of Wuxi Lead Laser Intelligent Equipment Co.,Ltd.
何建锡, 无锡先导集团 VP，无锡光导精密科技有限公司，副总经理
   
* Agenda is subject to change
* 会议议程更新中，以会议现场资料为准。
   
CONTACT US:
Hannah zhao 021-60278571 [email protected]
Early bird registration is open now!