DESMOND HOR 何建锡
VP of Wuxi Lead Group; VGM of Wuxi Lead Laser Technology Co.,Ltd.
无锡先导集团 VP，无锡光导精密科技有限公司，副总经理

讲师简介 / Speaker Bio

Desmond Hor is an esteemed industry veteran and currently holds the position of Vice President at Lead Laser, a wholly-owned subsidiary of Wuxi Lead Group, a globally renowned manufacturer of new energy equipment. In his current capacity, Desmond is entrusted with leading the company's global commercial operations and driving optimal revenue outcomes. He assumes overall responsibility for the Lead Laser product line, encompassing new product launches, sales and marketing initiatives, customer support, and financial performance.
With a career spanning over two decades in product management, sales, and marketing within the electronics and semiconductor industry across China and Southeast Asia, Desmond commands great respect in his field. He has been an active contributor to the semiconductor ecosystem in China, instrumental in fostering collaboration between China and Southeast Asia. Desmond's extensive industry knowledge and experience are underscored by his notable senior management positions in various semiconductor capital equipment companies, where he has successfully expanded their market reach.
Desmond holds a Bachelor's degree in Electrical Engineering from the University Teknologi Malaysia and a Master's in Business Administration from the University of British Columbia, Vancouver.

摘要 / Abstract

Laser Application and Challenges in Semiconductor Advanced Heterogeneous Packaging
Semiconductor advanced heterogeneous packaging plays a crucial role in enabling high-performance electronic devices. This presentation focuses on the application of lasers in this rapidly evolving field and the associated challenges. Laser technology offers precise and versatile solutions for various processes involved in advanced heterogeneous packaging. This presentation highlights the significant role of lasers in semiconductor advanced heterogeneous packaging, focusing on Laser Stealth Dicing, Laser Grooving, Laser Wafer Backside Marking, and Laser Wafer Drillhole machines.