Semiconductor Manufacturing and Advanced Packaging Forum


Date: Wednesday, November 2, 2022
Time: 09:30-16:30
Venue: Yangtze River Hall, Shanghai International Convention Center

Attendee Registration   Previous Review: Advanced Manufacturing   Previous Review: Advanced Packaging

Semiconductor is the fundamental of electronic industry. By co-designing in the manufacturing and heterogeneous integration approach, optimizing for AR/VR, 5G, Smart Auto application, innovators cross the ecosystem will be able to deliver the next extension of Moore’s law.

In this forum, global industry leaders and experts will share their prospect of system integration solution with advanced packaging and system integration, from the prospective of key technology, equipment and material, and supply chain development.

SPONSORS

         
 
         

KEY TOPICS:
  • Technology innovation and market trends
  • Manufacturing, key equipment and material
  • Testing solution
  • System integration solution
Agenda / 议程
   
9:00-9:30 注册 Registration
   
Moderator / 主持人:
Adam He Ph.D 何新宇 博士
Executive Director, CGP Tech Fund
盛世投资,董事总经理
   
9:30-9:45
开幕致辞Opening Remarks
Lung Chu, President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
09:45-10:10
Advanced Packaging Design Challenges and EDA Solution
先进封装的设计挑战与EDA解决方案

凌峰,芯和半导体科技(上海)有限公司 CEO
   
10:10-10:35
Trend driving the increasing adoption rate of System-Level Test
推动系统级测试采用率不断提高

Jason Zee, Global Vice President, China Managing Director, Storage and System Level Test Business Group General Manager, Teradyne
徐建仁,泰瑞达全球副总裁,中国区总裁,存储和系统级测试事业部总经理
   
杨雪芳,泰瑞达中国现场应用技术支持经理
   
10:35-11:00
China EV Car Booming – Opportunity for Power Semiconductor
中国电动汽车发展 — 功率半导体的机遇和挑战

Dr. Jeffrey Wang, CEO, Simgui Technology
王庆宇,上海新傲科技股份有限公司总经理
   
11:00-11:25
半导体划片制程及精密点胶工艺
卢国艺,深圳市腾盛精密装备股份有限公司副总裁
   
11:25-11:50
8英寸刻蚀完整解决方案,助力新应用发展
Wang Na, VP, NAURA
王娜,北方华创微电子副总裁
   
11:50-13:30 Break / 休息
   
Moderator / 主持人:
张文达,SEMI 中国高级总监
   
13:30-13:55
Heterogeneous integration, Next milestone in packaging technology
异构集成,封装技术的里程碑

邰利,Lam Research先进封装技术专家
   
13:55-14:20
Grow with semiconductor development: Sampling analytic, real-time monitoring and yield prediction
与半导体发展同行:取样分析,实时监测与良率预测

马兴刚,梅特勒托利多过程分析部门总经理
   
14:20-14:45
eV Brings New Opportunities for SEMI Packaging
电动汽车带来的封装机遇

RUSSELL LIU, VP, CHINA WAFER LEVEL CSP CO. LTD
刘宏钧,苏州晶方半导体科技股份有限公司副总
   
 Semiconductor Industry Analysis Session
 半导体产业分析专场
   
14:45-15:10
杨绍辉
光大证券研究所机械制造研究首席分析师
   
15:10-15:35
Dr Shiuh-Kao Chiang姜旭高
MANAGING PARTNE, Prismark LCC
Prismark合伙人
   
15:35-16:00
Dan Tracy
Senior Director Market Research, TECHCET LLC
TECHCET LLC市场研究高级总监
   
16:00-16:25
Gabriela PEREIRA & Taguhi YEGHOYAN
Technology and Market Analyst, Yole Développement
Yole Développement技术及市场分析师
   
16:25-16:30 Closing Remark
   
* 议程变化恕不另行通知
   

Contact Us

Hannah Zhao

Tel: 021-60278571

Email: [email protected]