Semiconductor Manufacturing and Advanced Packaging Forum


Date: Friday, October 7, 2022
Time: 09:30-16:30
Venue: New Tech Stage, Hall W1, Shanghai New International Expo Centre

Attendee Registration   Previous Review: Advanced Manufacturing   Previous Review: Advanced Packaging

WSTS expects the worldwide semiconductor market growth to rise from 6.8 percent in 2020 to an outstanding 25.6 percent in the year 2021, which corresponds to a market size of US$ 553 billion. This will be the biggest step-up, since a 31.8% increase in 2010, eleven years ago.

Since 2020, the epidemic has changed the way people work, brought more digitalized scenarios to reality and improved the government and public acceptance of digital transformation.

Semiconductor is the of key of digital transformation and fundamental of electronic industry. By co-designing in the advanced manufacturing and heterogeneous integration approach, optimizing for AR/VR, 5G, Smart Auto application, innovators cross the ecosystem will be able to deliver the next extension of Moore's law.

In this forum, global industry leaders and experts will share their prospect of system integration solution with advanced manufacturing and heterogeneous integration, from the prospective of key technology, equipment and material, and application trends.

KEY TOPICS:
  • Technology innovation and market trends
  • Manufacturing, key equipment and material
  • Heterogeneous Integration Roadmap (HIR)
  • Chip design and application requirement
  • Testing solution
  • System integration solution
Early bird registration is open now!

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Hannah Zhao

Tel: 021-60278571

Email: [email protected]