Semiconductor Manufacturing and Advanced Packaging Forum


Date: Wednesday, November 2, 2022
Time: 09:30-16:00
Venue: Yangtze River Hall, Shanghai International Convention Center

Attendee Registration   Previous Review: Advanced Manufacturing   Previous Review: Advanced Packaging

The global Semiconductor market increase 26.2% to US$ 556, which was the biggest step-up, since a 31.8% increase in 2010, eleven years ago. In June 2022, WSTS revised upward the forecast of 2022 growth rate to 16.3%, which corresponds to a market size of US$646.

Semiconductor is the fundamental of electronic industry. By co-designing in the manufacturing and heterogeneous integration approach, optimizing for AR/VR, 5G, Smart Auto application, innovators cross the ecosystem will be able to deliver the next extension of Moore’s law.

In this forum, global industry leaders and experts will share their prospect of system integration solution with advanced packaging and system integration, from the prospective of key technology, equipment and material, and supply chain development.

SPONSORS

         
         

KEY TOPICS:
  • Technology innovation and market trends
  • Manufacturing, key equipment and material
  • Heterogeneous Integration Roadmap (HIR)
  • Chip design and application requirement
  • Testing solution
  • System integration solution

时间:2022年11月2日
地点:上海国际会议中心,五楼,长江厅
 
9:00-9:30
注册 Registration
 
9:30-9:45
开幕致辞Opening Remarks
居龙,SEMI全球副总裁、中国区总裁
Lung Chu, President, SEMI China; Vice President, SEMI
 
主题演讲 Keynote Session:
 
异质整合路线图
Dr. Bill Bottoms, Co-Chair of HIR, Chairman of 3MTS
 
EDA助力系统级封装SiP产业发展
凌峰,芯和半导体科技(上海)有限公司 CEO
 
先进封装技术的挑战和发展
长电科技 JCET
 
Heterogeneous integration, Next milestone in packaging technology
异构集成,封装技术的里程碑

邰利,先进封装技术专家,Lam Research
 
Trend driving the increasing adoption rate of System-Level Test
推动系统级测试采用率不断提高的趋势

Jason Zee, Global Vice President, China Managing Director, Storage and System Level Test Business Group General Manager, Teradyne
徐建仁,泰瑞达全球副总裁,中国区总裁,存储和系统级测试事业部总经理
 
先进制造设备工艺解决方案
北方华创 NAURA
 
半导体行业激光切割技术
汪昊,无锡先导智能装备股份有限公司激光事业部总经理
 
Grow with semiconductor development: Sampling analytic, real-time monitoring and yield prediction
与半导体发展同行:取样分析,实时监测与良率预测

马兴刚,梅特勒托利多过程分析部门总经理
 
15:55-16:00
Closing Remark
 

Contact Us

Hannah Zhao

Tel: 021-60278571

Email: [email protected]