Gabriela PEREIRA
Technology and Market Analyst, Yole Développement
Yole Développement技术及市场分析师

讲师简介 / Speaker Bio

Gabriela Pereira is in the packaging team within the Semiconductor, Memory, and Computing Division at Yole Intelligence (Yole). Gabriela focuses on advanced packaging platforms, develops technology and market reports, and is engaged in creating dedicated custom projects. Gabriela’s experience in the semiconductor field includes working at Amkor Technology, first for her master’s thesis and then as a R&D Engineer, where she collaborated on several package development projects. Gabriela holds a master’s degree in Metallurgical and Materials Engineering from the University of Porto, Portugal.

摘要 / Abstract

Advanced Packaging has become critical and effective for foundries and IDMs, increasing device performance and bandwidth, and reducing the gap between Si and PCB. OSATs are also following this trend, offering innovative advanced packaging solutions.
There is a strong growth in high-performance computing, cloud computing, networking, artificial intelligence, autonomous driving, and personal computing applications. Simultaneously, there are die power improvements at escalating cost associated with more advanced nodes, resulting in bigger and more complex dies. These trends triggered semiconductor industry to strategize system-level scaling with high-end packaging solutions instead of purely scaling FE advanced nodes. Heterogeneous integration is a potential path forward to optimize the scaling cost by partitioning SoC chips and scale only those most critical circuit blocks. Therefore, advanced packaging technologies with high interconnection density, high bandwidth, and high-power efficiency are needed.
In 2022, top players' capital expenditure for packaging will grow to reach $15.3B from $11.9B in 2021. Intel, TSMC, ASE and Samsung are presenting the highest capex for the year. Strong progress and investments in R&D and production are driving advanced packaging technologies. 3D SoC – die to wafer and die to die hybrid bonding is viewed as the next technology breakthrough to achieve 10μm fine pitch. Regarded as a front-end packaging technology, this enables system-level high-end performance with denser 3D IC stacking. Leading suppliers TSMC, Samsung and Intel are all targeting this by providing cutting-edge hybrid bonding solutions.
In 2021, the AP market represented 44% of the total IC packaging market. Due to strong momentum in the AP market driven by mega trends, the share of AP in the total semiconductor market is increasing continuously and will reach more than ~50% of the market by 2027. The Advanced Packaging (AP) market’s total revenue reached $34B in 2021 and is expected to record an 11 % Compound Annual Growth Rate (CAGR) reaching $562B in 2027.

Title (English):
“Advanced Packaging Technology & Market Trends”
Title (Chinese):
“先进封装技术及市场趋势”