Advanced Packaging Forum
| Date: | Thursday, March 18, 2021 |
| Time: | 13:00-16:25 |
| Venue: | Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
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In the past 50 years, Moore's "law" set the stage for long-term semiconductor strategy, cost efficiency, and research & development objectives. As the industry approaches 7 nm sizes and smaller, the pace slows, and perhaps approaches a limit to the linear shrink. Solutions are emerging in the 3rd dimension, from "system on a chip" to "system in a package".
The final edition of ITRS was published in 2016 and then Heterogeneous Integration Roadmap was formally launched by IEEE CPMT. This transition opens on new opportunities for investment and innovation in heterogeneous integration and system level solutions.
In this year's "Advanced Packaging Forum", we will address the emerging technology of advanced packaging, heterogeneous integration, its ecosystem, and the opportunities evolving with it.
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1. HIR（Heterogeneous Integration Roadmap）
2. 3D packaging, SIP (system in a package)
3. Advanced materials and equipment
4. Advanced materials and equipment
5. Industry trends and innovations
Agenda / 议程
