Dr. Yu-Po, Wang 王愉博
Vice President, R&D Center, SPIL

讲师简介 / Speaker Bio

Yu-Po Wang received Ph.D. in Mechanical Engineering from Binghamton University, State University of New York , U.S.A.

In 1997, he started career at Gintic Institute of Manufacturing Technology in Singapore.
He joins SPIL in 1998 and leads the R&D Package Application and Technology Support Team in substrate/package design, material characterization and advanced package.

Dr. Wang has strong knowledge and experience in packaging characterization including thermal/ electrical simulation, advanced material(co-development), design and advanced packaging development. He has over 83 patents in US.


• 1997-1998 Gintic Institute of Manufacturing Technology, Singapore
• 1998-Present SPIL, Taiwan