做大做强中国集成电路产业链
 
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做大做强中国集成电路产业链 - 先进制造与封测
| 日期: | 2017年3月15日 星期三 |
| 地点: | 上海浦东嘉里大酒店，浦东大宴会厅1+2+3 |
| 地址: | 上海市浦东新区花木路1388号 |
在市场、纲要和基金的推动下，集成电路产业热度不断发酵，今后的五年里中国将会新建十多座12寸晶圆厂，中道后道封测行业亦步亦趋。做大易而做强难，中国的集成电路制造产业要如何加强核心竞争力？从技术、市场、商业模式等方方面面，如何励精图治，锐意创新，通力合作？
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| 做大做强中国集成电路产业链 - 先进制造与封测 | |
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主持人： Dr. Yifan Guo Vice President, ASE |
| 9:00-9:05 |
Welcome speech Richard Salsman CFO and Vice President Operations, SEMI |
9:05-9:30
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Innovative 3D-SiP Package Technologies for More than Moore Era. 蓝章益 Senior Director, RD & Engineering Center, SPIL PPT下载 |
9:30-9:55
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Keynote Speech: 互利共赢 深化中国IC产业布局 雷海波 President, HLMC |
9:55-10:20
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国产处理器加速中国集成电路产业国际化进程 傅城 兆芯，VP PPT下载 |
10:20-10:45
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Heterogenous Integration and miniaturization for IC package solutions Dr. Jim Li Sr. Director, Central Engineering Integration, ASE |
10:45-11:10
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Assembly Development for Advanced SIP Module 徐玉鹏 VP of Engineering, ICPU of JCET |
11:10-11:35
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提升核心竞争力，做强中国集成电路产业链 许天燊 SMIC，全球市场部资深副总裁 |
11:35-12:00
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Advance Package 樊俊豪 Vice president, ASM PPT下载 |
| 做大做强中国集成电路产业链 - 装备和材料 | |
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主持人： Michael Young GM, APAC Sales, Marketing & Service, AE |
13:00-13:30
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Maximizing fab profitability through lifecycle services Mike McDonald Vice President, Global Service, AE |
13:30-14:00
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Keynote Speech: 高端装备国产化，小集成铸就大时代 赵晋荣 北方华创科技集团股份有限公司，总裁 |
14:00-14:30
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The back-end market analysis and TEL’s activity Mr. Kawauchi Takuo Region Strategy Division, TEL |
14:30-15:00
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Advanced Packaging Technology & Applications Thomas Bondur Corporate Vice President, Advanced Packaging, MEMS and IoT Business Group, Lam Research |
| 15:00-15:20 | Break |
15:20-15:50
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The Memory Evolution: 2D to 3D and Beyond Er-Xuan Ping Managing Director, Office of the Chief Technology Officer, Applied Materials, Inc. |
15:50-16:20
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Enable IC breakthroughs with MKS Instruments surrounding chambers Wei Shao General Manager, MKS Instruments (Shanghai) Ltd. |
16:20-16:50
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Build cost advantage by right capital equipment purchasing strategy 商海涵 盈球半导体科技（上海）有限公司，总经理 |