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Agenda / 议程
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09:00-09:30
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Registration 来宾登记
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09:30-09:40
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Moderator
Feng Ling, Founder and CEO, Xpeedic Co. Ltd
凌峰，芯和半导体科技（上海）股份有限公司，创始人及CEO
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09:40-10:00
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Welcome speech 欢迎致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
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Session 1: Heterogeneous integration enabling AI/5G
异构集成赋能AI/5G浪潮
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10:00-10:30
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Accelerating the AI economy through Heterogeneous Integration
异构集成加速人工智能经济发展
Ingu Yin Chang, Senior Vice President, Sales & Marketing, ASE
Ingu Yin Chang，日月光高级副总裁
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10:30-11:00
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Chiplet Packaging Technology: Current Status and Future Development
Chiplet 封装技术的现状和发展趋势
Dr. Yifan Guo, EVP, Yibu Semiconductor
郭一凡，易卜半导体，执行副总裁
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11:00-11:30
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Semiconductors for Sensors – A holistic perspective
半导体传感器 – 一个全面的视角
Leopold Beer, GM of Sensing Division, Renesas Electronics Corporation
Leopold Beer，瑞萨电子传感器事业部负责人
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11:30-12:00
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Fostering an Open and Inter-operable Chiplet Ecosystem
共建开放互通的芯粒生态
JianChen, Chief Architect, Aliyun, board member of CXL and UCle
陈健，阿里云智能首席云服务器架构师，CXL和UCle董事会成员
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12:00-13:30
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Lunch break
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13:30-13:40
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Moderator
Dr. Huili Fu, Senior VP of T-Head, Alibaba
符会利，阿里巴巴，平头哥高级副总裁
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Session 2: Advanced packaging technologies and key processes
先进封装技术与关键工艺
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13:40-14:00
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Wafer-level Heterogeneous Integration based on Through Glass Via Technology
基于圆片级玻璃通孔的异构集成技术
Dr. Daquan Yu, CEO of Xiamen Sky Semiconductor Co., Ltd.
于大全，厦门云天半导体科技有限公司，董事长
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14:00-14:20
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SOHTM reshapes the semiconductor ecosystem
专注异构集成，重塑半导体生态
Odd Hung, Co-CEO, ICLEAGUE TECHNOLOGY CO.,LTD.
洪齐元，芯盟科技有限公司，联席总裁
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14:20-14:40
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Chiplets and Advanced Heterogeneous Integration
小芯片及先进异构集成
Terry Wu, Director, Samsung Electronics
吴政达，三星电子，总监
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14:40-15:00
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Test Challenges in the AI Era
AI 时代下的测试“芯”挑战
Dr. Jeorge S. Hurtarte, Sr. Director, SOC Product Strategy, Teradyne Inc.
Dr. Jeorge S. Hurtarte, 泰瑞达SOC产品战略高级总监和首席营销策略师
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15:00-15:20
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Innovations in Equipment Drive Rapid Growth of the Advanced Packaging Industry in the Computing Era
以装备创新助推算力时代先进封装产业腾飞
Wang Na, VP, Beijing NAURA Microelectronics Equipment Co., Ltd.
王娜，北京北方华创微电子装备有限公司，副总裁
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15:20-15:40
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AI CHIP & JSSI Advanced PKG Total Solution
人工智能芯片以及芯德科技全方位先进封装解决方案
Zhang Zhong, JSSI, Vice General Manager
张中, 江苏芯德半导体科技有限公司, 副总经理
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Session 3: Design, inspection and ecosystem
设计、检测与生态系统
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15:40-16:00
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Development and Challenge of Heterogeneous Integration Technology
异质集成技术的发展与挑战
Si Chen, Director of Packaging System Engineering, Unisoc
陈思，紫光展锐封装系统架构部负责人
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16:00-16:20
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Heterogeneous integration technology and its prospects for Silicon photonics
硅光异质异构集成技术和展望
Weining Li, R&D Pilot Line Leader, SVP, SITRI
李卫宁，上海微技术工业研究院，研发中试线负责人，资深副总经理
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16:20-16:40
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Innovations in AI Chip Packaging: Advanced Processes & Equipment Technologies
AI 芯片封装的创新： 先进工艺和设备技术
Lee Chee Ping, Senior Director, Advanced Packaging Customer Operations, Lam Research Corporation
Lee Chee Ping, 泛林集团，先进封装客户运营资深总监
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16:40-17:00
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Future trends in advanced wafer-level packaging and the impact of miniaturization on defect inspection
晶圆级先进封装的未来趋势以及微小化对于缺陷检测的影响
Richard Yeoh, Senior Product Marketing Manager, KLA Corporation
Richard Yeoh, KLA 产品线资深市场经理
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17:00-17:20
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Heterogeneous Integration Fuels the Automotive Future
异构集成助推未来汽车
Shaun Bowers, Senior Analyst, TechSearch International, Inc.
Shaun Bowers, TechSearch International, Inc.高级分析师
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17:20-17:30
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Closing remark 闭幕致辞
Dr. Huili Fu, Senior VP of T-Head, Alibaba
符会利，阿里巴巴，平头哥高级副总裁
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* 议程以最终版为准
* Please refer to the final version of Agenda.
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