SearchResult

1. Mr. Terrance Lee

   ... VP of Product Management & Strategy Dielectric Deposition Produ...

   Basic page - 2020-06-12 17:19:32.0

2. 李健民 / Jianmin Li

   ...开发总监 Amkor Assembly & Test (Shanghai) Co., Ltd. 安靠封装测试（上海）有限公司 个...

   Basic page - 2020-06-04 14:31:17.0

3. 魏峥颖 / Raymond WEI

   ...Raymond WEI 魏峥颖 Vice President, Shanghai Huali Microelectronics Corp...

   Basic page - 2020-06-25 20:18:55.0

4. Actel Niu / 牛风举

   ...cccc; } Actel Niu 牛风举 Mentor, A Siemens Business，Account Technical M...

   Basic page - 2020-06-08 10:03:08.0

5. Dr. Yifan Guo / 郭一凡 博士

   ...lid #cccccc; } Vice President, ASE Group IEEE Fellow 日月光副总经理 IEEE Fe...

   Basic page - 2020-06-10 16:56:51.0

6. Yupeng Xu / 徐玉鹏

   ...端及芯片封装越发往高集成度、小型化、微型化发展，系统级封装技术（SiP）节省开发时间和避免试错成本，多功能模块集成的SiP技术越来越是封...

   Basic page - 2020-06-10 17:03:07.0

7. Yuan Lu / 陆原

   ...ssion on the advance material AlScN in the application of wireless c...

   Basic page - 2020-06-10 16:11:45.0

8. Calvin Fan / 范凯

   ... } Calvin Fan 范凯 Kulilcke & Soffa, 资深技术方案经理 个人简介 / Biography 范凯先...

   Basic page - 2020-06-10 16:16:54.0

9. Max.Cai / 蔡维伽

   ...px solid #cccccc; } Max.Cai 蔡维伽 Specialist Bonder Equipment, SUSS Mi...

   Basic page - 2020-06-10 16:22:45.0

10. Dr. Wei Li / 李炜 博士

    ...solid #cccccc; } Chairman, Zing Semiconductor Corporation 上海新昇半导体科技有...

    Basic page - 2020-06-15 10:28:00.0