Max.Cai 蔡维伽
Specialist Bonder Equipment, SUSS MicroTec (Shanghai) Co., Ltd
苏斯中国, 键合设备技术专家

个人简介 / Biography

Max.Cai is bonder equipment specialist of SUSS MircoTec. He joined SUSS on 2006, and since then focused on wafer bonding technology. He worked with SUSS global wafer bonding specialist team to support semiconductor foundries, institutes and universities in China, helped customers to settle and develop their wafer bonding technology in various of different applications for decade.

蔡维伽先生目前就任SUSS MicroTec公司的键合技术专家一职。自2006年加入SUSS以来,他便一直专注于晶圆键合工艺。十多年来,他和SUSS全球晶圆键合专家团队,与国内多家半导体工厂、研究所及大学共同工作,帮助客户研究,发展及完善晶圆键合工艺在半导体制造多个领域的应用。

摘要 / Abstract

Hybrid bonding as a way to bond two substrates by means of a dielectric layer while at the same time creating metallic interconnects between both substrates has been attracted increasing attention recently in the scope of 3D integrated packaging. When it comes to 3D-stacked ICs, restrictions derived from TSV- and yield processing limits become apparent. Especially the maximum achievable yield becomes critical at increased die stacking levels (KGI, or known-good die problem). Although this problem can be overcome by die-to-wafer (D2W) hybrid bonding, the amount of dies per 12” wafer (as a function of die size and spacing) quickly challenges maximum throughput considerations. A potential way out of this is collective D2W bonding, where a 12” carrier wafer is populated with the single (good) dies via die pick and place procedure and collectively hybrid bonded to the target wafer in a single step. In the scope of this presentation, some exemplary results of 300mm hybrid bonding will be presented, and also with explanation of challenges to achieve high yielding die-to-wafer bonding with micron range with respect to die overlay and process flow.