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1. Philip Gu

   ...参与建设了超过十亿用户的庞大的中国移动通讯网络；2014-2017, 作为TE Connectivity CPD事业部的全球销售主管，负...

   Basic page - 2018-03-12 10:11:16.0

2. Kevin Fairbairn

   ...sponsibility for PECVD. In his 17 years at Applied Materials, Kevin ...

   Basic page - 2018-03-06 13:37:43.0

3. Richard Qian

   ...y of Japan 分获工学学士及工商管理硕士学位。 他2007年加入东电电子（上海）有限公司，曾先后担任产品销售经理、产品部门长、半...

   Basic page - 2018-03-08 11:02:09.0

4. E. Jan Vardaman

   ...emiconductor packaging since 1987. She is the co-author of How to Ma...

   Basic page - 2018-03-14 11:45:38.0

5. FAQ

   ...ndeditor/file/20160921/20160921171045_250.pdf 2. Floor plan of SEMIC...

   Basic page - 2021-07-07 14:28:55.0

6. Daneng He

   ...门经理-制造总监-销售总监兼中芯太阳能国际公司制造总监等 1997-2002年 旺宏国际电子公司经理 1991-1997年 Sinova...

   Basic page - 2018-04-10 13:36:58.0

7. Zhongwen Zhang

   ...sion efficiency has reached 21.67%.

   Basic page - 2018-05-07 15:12:24.0

8. Zhonglin Lu

   ...Obtained Ph. D of Physics in 2007 from Nanjing University. Assistant...

   Basic page - 2024-12-04 15:26:01.0

9. CSTIC 2018

   ...tion Center 上海国际会议中心 中国上海浦东滨江大道2727号 No.2727 Riverside Avenue Pudong...

   Basic page - 2020-09-16 10:24:38.0

10. Symposium I: Device Engineering and Memory Technology (2018)

    ...tate University (UNESP) *16:35–17:00 III-V GaAs and InP HBT Dev...

    Basic page - 2018-04-17 11:40:58.0