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1. Paul Zhang / 张鹏岗

   ...ager China, as per June 1st, 2017. Before joining Nexperia, Paul was...

   Basic page - 2023-06-14 13:05:19.0

2. Dr. Hanming Wu / 吴汉明

   ...2年6月出生，江苏常州人。微电子技术（集成电路制造）专家。1987年毕业于中国科学院力学研究所，获博士学位。2019年当选中国工程院院士...

   Basic page - 2023-06-25 14:02:23.0

3. Chen Rongling / 陈荣玲

   ...982～1984)。84年加入美国应用材料公司。1984～2007期间，先后任市场发展经理、总监、副总裁，並任中国区副总裁、总裁、董事长...

   Basic page - 2023-06-26 16:19:40.0

4. Jason Xu / 许坚

   ...2004年加入BOC EDWARDS，担任中国区总经理。在2007年，他任EDWARDS中国区总经理。在此之前，他在英特尔公司海外部门工...

   Basic page - 2025-03-04 16:52:40.0

5. MEMS Enabled Liquid Biopsy

   ...with Prof. Tingrui Pan) from 2007-2008 and Caltech (with Prof. YC Ta...

   Basic page - 2024-02-02 14:41:14.0

6. Symposium I: Device Engineering and Memory Technology

   ... Science and Technology *16:45-17:10 Hardware-Based Neural Networks ...

   Basic page - 2023-07-07 13:30:28.0

7. Symposium II: Lithography and Patterning

   ...on     Tuesday, June 27, 2023 Shanghai International Conve...

   Basic page - 2023-07-07 13:34:44.0

8. Symposium III: Dry &Wet Etch and Cleaning

   ...c.     Tuesday, June 27, 2023 Shanghai International Conve...

   Basic page - 2023-07-07 13:43:33.0

9. Symposium IV: Thin Film, Plating and Process Integration

   ...ese Academy of Sciences *16:55-17:20 The Challenges of Carbon Nanotu...

   Basic page - 2023-07-07 13:46:11.0

10. Symposium V: CMP and Post CMP Cleaning

    ...gy     Tuesday, June 27, 2023 Shanghai International Conve...

    Basic page - 2023-07-07 13:49:42.0