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1. Benedetto VIGNA

   ...eld this position since January 2016. He is a member of ST's Executive...

   Basic page - 2020-06-16 13:10:01.0

2. Yanhui Zhao / 赵延辉

   ... Moving to MEMS product line in 2010 and concentrate on MEMS / Sensors...

   Basic page - 2020-06-16 13:12:11.0

3. Christian Bachmann

   ...D. in Electrical Engineering in 2011 at Graz University of Technology ...

   Basic page - 2020-06-16 13:14:36.0

4. Dr. Daquan Yu / 于大全

   ...g Technology of TSHT Group from 2014 to 2019. Before that, he was a pr...

   Basic page - 2020-06-19 14:52:12.0

5. Dr. Tianniu (Rick) Chen / 陳天牛

   ...f former Versum Materials since 2016 and held positions as a global bu...

   Basic page - 2024-12-04 16:17:27.0

6. DeWen Tian / 田德文

   ...种2.5D/3D先进封装制程以及封装仿真、可靠性与失效分析等。 2017年加入歌尔，负责组建青岛市先进封装技术公共服务平台, 该平台投资1....

   Basic page - 2020-06-19 15:01:27.0

7. Terry Chen

   ...ea. Joined Oxford Instrument in 2017, now in charge of the business in...

   Basic page - 2020-06-22 09:57:42.0

8. Leopold Beer

   ...ting and Product Planning. From 2013 until 2018, he held the position ...

   Basic page - 2020-06-23 16:47:57.0

9. LeiLei Shinohara / 篠原磊磊

   ...a joined RoboSbense in January, 2019. From 2015 to 2018, he was the Te...

   Basic page - 2020-06-23 16:50:33.0

10. Feng Guo / 郭峰

    ...发及解决方案规划设计及市场推广领域有超过15年的实践经验。郭峰于2016年加入华为，目前担任中国政企智能制造业务部解决方案总监，承担众多国内...

    Basic page - 2020-06-25 21:03:58.0