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1. Package: Advanced Wafer Level Package, System in Package (SIP) and Testing

   Date: Tuesday, March 19, 2019 Venue: Shanghai International Con...

   Basic page - 2019-02-28 11:40:15.0

2. Koukou Suu

   ...ies of the company from 2008 to 2014. Now he is ULVAC Senior Fellow an...

   Basic page - 2019-03-05 10:41:13.0

3. Dr. Yukiteru Matsui

   ...stitute of Technology, Japan in 2011 and his Master’s degree and Bache...

   Basic page - 2019-02-22 14:35:25.0

4. Prof. Horng-Show (Frank) Koo

   ...2007 as an assistant professor, 2010 as an associate professor and 201...

   Basic page - 2021-10-18 20:16:49.0

5. James Huang

   .... Manager, Qorvo Biography 黄靖先生于2011年加入Qorvo的前身之一威讯联合半导体（RFMD）销售部门。201...

   Basic page - 2019-01-18 14:44:19.0

6. 井川 拓人 / Igawa Takuto

   ...or of Electrical engineering in 2010 and Master of Engineering in 2012...

   Basic page - 2019-12-27 15:12:12.0

7. Dr. Carlos Mazure

   ... Industry Consortium since July 2014. IEEE Fellow, 34 years of experie...

   Basic page - 2019-03-15 17:27:38.0

8. Bennini Fouad

   ...try at Bosch Sensortec GmbH. In 2010, he joined Bosch eBike Systems di...

   Basic page - 2019-01-28 10:10:39.0

9. Andrea Onetti

   ...s position since last February, 2016. Onetti joined STMicroelectronics...

   Basic page - 2019-01-28 09:55:04.0

10. Filippo Di Giovanni

    ...r semiconductors. Starting from 2012, as BU manager he worked for the ...

    Basic page - 2020-06-12 11:00:53.0