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1. Doug Bailey

   ...ey joined Power Integrations in 2004 as vice president of marketing. P...

   Basic page - 2025-02-14 15:23:35.0

2. David Haynes

   ...e manufacturing is performed on 200mm wafers. But the recent advances ...

   Basic page - 2025-02-28 11:12:41.0

3. Lewis LU / 陆振国

   ...理经验。担任上海协微科技有限公司的产品及应用总监。 职业经历： 2007~2010 台积电（中国）有限公司 （TSMC) 设备工程师 201...

   Basic page - 2025-02-06 13:40:07.0

4. Dr. Xiaojun Zhang / 张晓军

   ...次人才，入选科技部创新创业推进计划，发表SCI文章20篇，已申请200余项中美专利。

   Basic page - 2025-02-10 12:14:20.0

5. Dr. Yunchun Yang

   ...eas from March 1998 to December 2007; He returned to China at the begi...

   Basic page - 2025-01-24 13:04:38.0

6. Fisher Zhang / 张震宇

   ...ng from Southeast University in 2003 and 2006 respectively. 摘要 / Abstr...

   Basic page - 2025-02-24 11:28:26.0

7. Mike Rosa

   ...wafer size migrations, 150mm-to-200mm and 200mm-to-300mm for SiC and G...

   Basic page - 2025-02-08 11:36:20.0

8. Peter Lendermann

   ...Europe, Canada and China. Since 2000 he led the simulation-related res...

   Basic page - 2025-02-25 14:50:58.0

9. Erwan Sourty

   ...cientific. Based in China since 2008, serving as an application scient...

   Basic page - 2025-02-17 10:57:18.0

10. Dr. Vincenzo Pecunia

    ...iversity of Cambridge, UK, from 2009 to 2016.  His research break...

    Basic page - 2025-02-17 14:00:43.0