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1. 何进

   ...型和TCAD等方面的研究工作已发表论文500多篇，被SCI收录近200余篇，EI收录250多篇，国际引用或下载超过一万余次。 指导出站博士后...

   Basic page - 2021-01-26 11:00:50.0

2. Dr. Zheng Yuan

   ...He is responsible for all 300mm/200mm/150mm equipment development and ...

   Basic page - 2021-02-09 11:11:39.0

3. Dr. Chuanyun Wan

   ...rsity with a doctoral degree in 2001. Later, as a postdoctoral fellow,...

   Basic page - 2023-04-24 14:22:23.0

4. Dr. Jingtong Hu

   ...m Shandong University, China in 2007. His current research interests i...

   Basic page - 2022-05-13 14:12:45.0

5. Dr. Wei Li 李炜

   ...ersity, followed by his Ph.D in 2000 from the Microelectronics at Shan...

   Basic page - 2021-02-23 15:01:28.0

6. Sam Sun 孙成思

   ... BIWIN 佰维存储董事长 个人简介 / Biography 2008年9月—2011年6月 毕业于牛津布鲁克斯大学商学院，本科学历； 2...

   Basic page - 2021-02-04 17:40:08.0

7. Development of CMOS Integrated Process

   ... China University of Technology 2009 – 2017 Institute of Microelectron...

   Basic page - 2022-06-07 11:40:44.0

8. Prof. David Z. Pan

   ...SP-DAC 2017 TPC Chair, and ISPD 2008 General Chair. He has received ma...

   Basic page - 2021-11-16 11:14:55.0

9. Dr. Zhijian(George) Lu 吕志坚

   ...epartment Manager in 1999. From 2002 to 2007 George worked for Texas I...

   Basic page - 2021-03-09 18:05:48.0

10. 周健威

    ...mory 3D NAND Flash已突破128层，176层甚至200层以上的3D NAND 会在未来1~2年陆续面世；而DRAM也已从14...

    Basic page - 2021-03-04 16:34:53.0