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  1. Symposium IV: Thin Film, Plating and Process Integration (2018)

    ...; Lei Zhang, AMAT Monday, March 12, 2018 Shanghai International Conve...

    Basic page - 2018-04-17 11:43:37.0

  2. Symposium V: CMP and Post-Polish Cleaning (2018)

    ...Applied Materials Monday, March 12, 2018 Shanghai International Conve...

    Basic page - 2018-04-17 11:45:51.0

  3. Symposium VI: Metrology, Reliability and Testing (2018)

    ...ou Xiaodong, SMIC Monday, March 12, 2018 Shanghai International Conve...

    Basic page - 2018-04-17 11:46:46.0

  4. Symposium VII: Packaging and Assembly (2018)

    ...ipeng Huang, AMAT Monday, March 12, 2018 Shanghai International Conve...

    Basic page - 2018-04-17 11:47:34.0

  5. Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies (2018)

    ...Research Co., Ltd Monday, March 12, 2018 Shanghai International Conve...

    Basic page - 2018-04-17 11:48:28.0

  6. Symposium IX: Design and Automation of Circuits and Systems (2018)

    ...anghai University Monday, March 12, 2018 Shanghai International Conve...

    Basic page - 2018-04-17 11:49:26.0

  7. Prof. Bin Gao

    ...EDS PhD Student Fellowship in 2012.

    Basic page - 2018-10-16 12:58:40.0

  8. Memory Strategic Forum

    ...Znm process, SK Hynix announced 128 layers 4D NAND paired with its Pe...

    Basic page - 2020-10-13 16:15:05.0

  9. Will Conley

    ...ed Cymer (an ASML company) in 2012. He is currently in the Applicatio...

    Basic page - 2018-10-26 11:04:00.0

  10. Prof. Hai Wang

    ...rnia, Riverside, in 2008, and 2012, respectively. He is currently an ...

    Basic page - 2019-09-10 11:32:58.0