Memory Strategic Forum

Date: Monday, June 29, 2020
Time: 08:45-11:25
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

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For Memory business, 2019 is a year of significant. According to IC Insight, capital investment will reduce 8% from $105.9 billion in 2018 to $97.8 billion in 2019. In the contrary, technology evolution is speeding up. Mainstream DRAM density goes up to 16Gb per chip on 1Znm process, SK Hynix announced 128 layers 4D NAND paired with its Periphery Under Cell (PUC) technology.

China Memory industry is forging quickly. YMTC launched production of 64 layers 3D NAND on Xtacking technology, Unigroup announced it's DRAM strategy, Innotron started the production of 8Gb DDR4.

In the era of Big Data, AI and IOT, explosive needs of low-power computing demands Memory innovations. 3D packaging, MRAM, PCRAM and RERAM move toward maturity, in-Memory computing is an emerging concept.

Let us meet again in SEMICON CHINA 2020!


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Agenda / 议程
08:45-09:15 Registration 来宾登记
  Moderator / 主持人
Gavin Wang 王兆华
AI Memory for Data Intensive Applications
針對數據密集型應用之 AI Memory

Dr. Alex Wang 王其国
President 总经理
Powerchip Technology Corporation 力晶科技股份有限公司
Keynote: Memory technology and brand

Huabo Cai 蔡华波
Board Chairman 董事长
Longsys Electronics 江波龙电子
10:10-10:35 Memory Device Trend and Test Technology Challenges
Jintie Li 李金铁
Vice President 中国区副总经理
Advantest 爱德万测试
Dr. David Wang 王晖
Board Chairman 董事长
ACM Research 盛美半导体设备(上海)股份有限公司
Memory packaging technology

Jianmin Li 李健民
Packaging R&D Director封装技术开发总监
Amkor Assembly & Test (Shanghai) Co., Ltd. 安靠封装测试(上海)有限公司
* Agenda is subject to change
* 议程变化恕不另行通知