Plenary Session
Date: CSTIC 2017, Sunday, March 12, 2017
Venue: SHICC 上海国际会议中心 中国上海浦东滨江大道2727号
Distinguished Conference Keynote Speakers
Panel Discussion
Future Memory Technologies
Sunday, March 12, 2017
Meeting Room: 3B
17:00-18:30
Moderator: Dr. Hsiang-Lan Lung
Panel Members: Dr. Simon Yang, Dr. Min-Hwa Chi, Dr. Chung Lam, Dr. Luca Perniola, Dr. Tetsuo Endoh, Dr. Jong-Ho Lee
Parallel Symposium Oral Sessions
Sunday, March 12, 2017 | |
13:30 – 18:00 | Parallel Symposium Oral Sessions |
Coffee Break | Conference Poster Session |
Monday,March 13,2017 | |
8:00-18:00 | Parallel Symposium Oral Sessions |
Joint Sessions
Symposium II and Symposium III-Lithograpy/Etch joint session Sunday, March 12, 2017
Shanghai International Convention Cente
Meeting Room: 3rd Floor Yellow River Hall黄河厅
Session Chairs: Kafai Lai (IBM) and Ying Zhang (Applied Material)
13:30-13:35 | Opening Remarks |
Kafai Lai / Ying Zhang | |
**13:35-14:05 | The Path Forward: The Future of Optical Lithography |
Donis Flagello, Nikon Research America | |
**14:05-14:35 | Patterning Technology Inflections for the 10nm and Beyond Logic Nodes |
Rich Wise, Lam Research | |
*14:35-14:55 | Development of 250W EUV light source for HConsiderations for pattern fidelity control towards 5nm nodeVM lithography |
Hidetami Yaegashi, TEL | |
*14:55-15:15 | The Insertion of extreme ultraviolet lithography (EUVL) from patterning perspective |
Weimin Gao, Synopsys | |
15:15-15:30 | Coffee Break |
Symposium II and Symposium IX-DTCO Joint session
Monday, March 13, 2017
Shanghai International Convention Center
Meeting Room: 3rd Floor Yellow River Hall黄河厅
Session chairs: Leo Pang / Yiyu Shi
*8:30-8:35 | Opening Remarks |
Leo Pang / Yiyu Shi | |
**8:35-9:05 | Design Technology Co-optimization for Disruptive Patterning Schemes |
Puneet Gupta, UCLA | |
**9:05-9:35 | Software Defined Chip: Technologies, Challenges and Opportunities |
Shaojun Wei, Tsinghua University | |
*9:35-9:55 | Data Analytics and Machine Learning for Design-Process-Yield Optimization in Electronic Design Automation and IC Semiconductor Manufacturing |
Luigi Capodieci, Motovi.ai | |
9:55-10:10 | Coffee Break |
Symposium I: Device Engineering and Memory Technology
Symposium II: Lithography and Patterning
Symposium III: Dry &Wet Etch and Cleaning
Symposium IV: Thin Film, Plating and Process Integration
Symposium V: CMP and Post-Polish Cleaning
Symposium VI: Metrology, Reliability and Testing
Symposium VII: Packaging and Assembly
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
Symposium IX: Circuit Design, Systems and Applications
Conference Banquet
Sunday, March 12, 2017
Banquet fee
800RMB/Person
Online Registration link;
http://121.41.226.59/semi2017/Visitor/Conference.aspx?lang=en&uid=
18:30 – 20:00
Conference Banquet, 上海小南国国会店(http://www.xnggroup.com)
上海市浦东新区滨江大道2727号7楼
Hotel Floor Layout