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March 14-16,2018
Shanghai New International Expo Centre

Prof. Rao Tummala

Prof. Rao Tummala 
Joseph.M Pettit Chair Professor in ECE and MSE
Director, 3D Microsystems Packaging Research Center
Georgia Research Alliance Eminent Scholar
Georgia Institute of Technology, Atlanta,  Ga, USA

Prof. Rao Tummala is a Distinguished and Endowed Chair Professor at Georgia Tech USA. He is well known as an industrial technologist, technology pioneer, and educator. Prior to joining Georgia Tech, he was an IBM Fellow, pioneering such major technologies as the industry’s first plasma display and the first and next three generations of 100 chip multi-chip packaging. He is the father of LTCC and System-on-Package technologies. As an educator, Professor Tummala was instrumental in setting up the largest Academic Center in Electronic Systems at Georgia Tech involving more than 100 Ph.D and MS students, 25 faculty from ECE, ME, MSE and CHE, and 70 companies from the U.S., Europe and Asia, all working together with an integrated approach to research, education and industry collaborations. He published  700 technical papers and invented 98 patents,  wrote the first textbook in packaging , Microelctronics Packaging Handbook, wrote the 1st undergrad textbook  called Fundamentals of Microsystem Packaging and 1st book introducing the System-On-Package Concept.