Power & Compound Semiconductor Applications in Automotive Summit Forum



 功率及化合物半导体主题活动安排
 时间/Time  活动名称/Event
 3月21日 09:00-17:00
 Mar. 21st 09:00-17:00 		 功率及化合物半导体产业国际论坛
 Power & Compound Semiconductor International Forum
 3月22日 09:20-17:00
 Mar. 22nd 09:20-17:00 		 功率及化合物半导体汽车应用发展高峰论坛
 Power & Compound Semiconductor Applications in Automotive Summit Forum
 地点：上海浦东嘉里大酒店, 浦东厅 1
 Venue: Pudong Ballroom 1, Kerry Hotel Pudong, Shanghai
 
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "Power & Compound Semiconductor International Forum", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized on March 21-22, 2024 in Kerry Hotel at Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications,Emerging Power Device Technology, and Applications in Automotive.

Gold Diamond Sponsor：

SPONSORS

         
         
         
   
  Registration / 注册
   
Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
   
受邀讲师 / Invited Speakers：
   
MicroLED Technology Entering Mass Production: Opportunities and Challenges in The New Era
MicroLED技術的量產：機會與挑戰的新時代
李允立，錼創科技，董事长
Dr. Yun-Li (Charles) Li, Chairman of PlayNitride Inc.
   
Compound Semiconductor Infrared Measurement Technology and Equipment
化合物半导体红外量测技术与设备
任杰，盖泽华矽半导体科技（上海）有限公司，总经理&首席执行官
   
ST 意法半导体
   
GaN Progress on Large Size of Substrates
大尺寸GaN材料的新进展
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯，苏州晶湛半导体有限公司，董事长、总裁
   
ASM China
   
Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造
Dr. Wuping Liu, VP of Customer Applications & Technology of Jiangsu Leuven Instruments Co., Ltd.
刘武平，江苏鲁汶仪器股份有限公司，产品研发中心副总经理
   
High Throughput Epitaxy Solution for Compound Semiconductors
化合物半导体的高产能外延解决方案
Ziwen Fang, Vice General Manager of AIXTRON China
方子文，德国爱思强股份有限公司，中国区副总经理
   
Lam Reaserch
   
Applied Materials
   
Domestic Silicon Carbide Equipment Help The Rapid Development of The Third-generation Semiconductor Industry
国产碳化硅装备助力三代半产业腾飞
Boyu Dong, President of Beijing NAURA Microelectronics Equipment Co.,Ltd
董博宇，北京北方华创微电子装备有限公司，总裁
   
Applications of Laser Technology in Power and Compound Semiconductor Industries
激光技术在功率及化合物半导体产业的应用
巫礼杰，深圳市大族半导体装备科技有限公司，技术副总经理
   
应用于碳化硅模块的先进烧结方案
张靖，贺利氏，研发中心负责人
   
Towards More Powerful and Reliable Devices - Thermo Fisher R&D and FA Solutions
Xiaoxiao Cao, Senior Manager of Market and Business Development, Thermo Fisher
曹潇潇，赛默飞世尔，市场及业务拓展资深经理, PFA
   
更多重磅嘉宾，将陆续上线，敬请期待！
   


Two-day registration fee:
Type Before Mar.1 with Advanced Payment
(Early Bird) 		After Mar.1 and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change

联系方式 / Contacts：
徐天天 / Robin Xu 李晓倩 / Cassie Li 冯莉 / Lily Feng
Tel: 021.6027.8553 Tel: 021.6027.7645 Tel: 021.6027.8546
Email: [email protected] Email: [email protected] Email: [email protected]