Plenary Session

Date: Monday-Tuesday, March 18-19, 2019
Venue: Shanghai International Convention Center 上海国际会议中心
  No.2727 Riverside Avenue Pudong, Shanghai 200120, China 中国上海浦东滨江大道2727号

Distinguished Conference Keynote Speakers

Dr. Simon M. Sze Dr. Yaoguo (Gary) Ding Dr. Min Cao Dr. Evangelos Eleftheriou
Honorary Chair Professor

Vice President, Technology and Manufacturing Group
Vice President, Path-finding
Fellow, Neuromorphic Computing

Monday, March 18, 2019
Meeting Room: 3rd Floor Auditorium
08:45-09:30 Opening Ceremony
  Opening Remarks by Conference Chair
  Opening Remarks by SEMI
  Opening Remarks by IMEC
  Opening Remarks by STCSM
  Opening Remarks by Sponsors
  Presentation of IMEC Best Student Paper Awards and SEMI Best Young Engineer Paper Awards
09:30-10:15 The Floating-Gate Memory from Concept to Flash Memory to the Fourth Industrial Revolution
  Dr. Simon M. Sze
  Honorary Chair Professor, NCTU
10:15–10:50 Moore's Law and Evolving Challenges in Technology Scaling
  Dr. Yaoguo (Gary) Ding
  Vice President, Intel
10:50–11:25 Semiconductor Innovation and Scaling: A Foundry Perspective
  Dr. Min Cao
  Vice President, Path-finding, TSMC
11:25–12:00 "In-memory Computing": Accelerating AI Applications
  Dr. Evangelos Eleftheriou
  Fellow, Neuromorphic Computing, IBM

Parallel Symposium Oral Sessions

Monday, March 18, 2019
13:30-17:00 Parallel Symposium Oral Sessions
Coffee Break Conference Poster Session
Tuesday, March 19, 2019
8:30-18:00 Parallel Symposium Oral Sessions

Panel Discussion

17:00-18:30, Monday, March 18, 2019
Technologies for AI Chips: Challenges and Opportunities

Training Courses

14:00-17:00, Tuesday, March 19, 2019
Workforce Development Advanced Memory Technologies: 3D NAND, DRAM and 3D PCM
Workforce Development Package: Advanced Wafer Level Package, System in Package (SIP) and Testing

Joint Sessions

13:30-15:20, Monday, March 18, 2019
Symposium II and III-Lithography/Etch joint session
10:30-12:00, Tuesday, March 19, 2019
Symposium II, VIII and IX-AI joint session

Parallel Symposium Oral Sessions

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems

Conference Banquet

Monday, March 18, 2019
Banquet fee

Online Registration link;

18:30-20:30 Conference Banquet, 上海小南国国会店(

Hotel Floor Layout