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日期：2014年3月19日 （星期三）
时间：13:00-17:00
地点：Pudong Ball room 2+3, 上海浦东嘉里大酒店
China's 12th Five-Year development plan (2011-2015) promises to further the growth of the China’s semiconductor industry, targeting the expansion of China's entire supply chain from design to manufacturing to serve the needs of the booming domestic market. Together with the booming growth of LED, FPD and PV market, it is a great opportunity for both local and international equipment suppliers to grow together with the industry.
In conjunction with SEMICON China 2013, SEMI China will organize Parts and Equipment OEM market conference, which focuses on the equipment and parts supply chain. The conference provides a good platform for industry experts to discuss suitable local supply models for different suppliers, policy instructions, successful breakthrough experience sharing, etc. It also offers a good opportunity to reach customers from China’s semiconductor manufacturing industry.
Overview & Policy of Equipment & Parts Manufacturing in China
Development of semiconductor manufacture technology
Equipment cost down to meet market demand
International cooperation in equipment industry
Supply chain in China
Used tool market
- Executives and managers from equipment, parts and subsystem, material companies.
- Executives and purchasing managers from foundries, packaging & test houses, and LED/FPD/PV manufacturers.
- China city industry park officers.
Moderator
Ni Lihua,Senior Director, Shanghai Huali Microelectronics Corporation
13:00~13:10
Opening Remark
13:10~13:40
张国铭
北京七星华创电子股份有限公司副总经理
SEMI中国半导体设备委员会轮值主席
下载会议资料
13:40~14:10
张天豪
应用材料公司中国区总裁
应用材料公司半导体中国区事业部总经理
下载会议资料
14:10~14:40
刘韶华
北京北方微电子公司副总裁
14:40~15:10
15:10~15:40
Michael Chu
Vice president, Advanced Micro-Fabrication Equipment Inc.
下载会议资料
15:40~16:10
钱立群
总监，东电电子（上海）有限公司
16:10~16:40
商海涵
盈球半导体科技（上海）有限公司总经理
16:40 -16:50
Closing and lucky draw (Huawei P6S Smart Phone)
JY Zhang SEMI China
Tel: 86-21-60278556
Fax: 86-21-60278511
Email:[email protected]