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同期技术论坛:

·超越摩尔技术论坛
·中国设备市场论坛
·IC设计与制造技术论坛
·先进封装技术论坛
·LED China论坛 2014
·可穿戴设备技术论坛
 


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日期:2014年3月20日 (星期四)
时间:13:00-17:00
地点:Pudong Ball room 2+3, 上海浦东嘉里大酒店
语言:英语


  
    
 
    



Nowadays, electronic products, Smart Phone, tablets, wearable device, are becoming shorter, smaller, thinner, and lighter. To meet these requirements, we need to scale down the device node according to Moore’s Law. However, as the scale of the device node shrinks, Moore’s Law has reached its limit. Advanced Packaging Integration is alternative way to drive performance.

In conjunction with SEMICON China 2014, SEMI China will organize Advanced Packaging Technology Forum, which will discuss the solution of Advanced Packaging, including 2.5D/3D packaging, WLP, Cu Pillar, High density TSV technologies, and analyze the market trend of these technologies. This forum provides a great platform for engineers, researchers and other industry peers to discuss advanced engineering and scientist information, ideas and solutions in the industry. It offers a good opportunity to reach customers from the china local IC industry.


Market Analysis of Advanced Packaging
Approaches Overview of Advanced Packaging Technologies
New Materials in Advanced Packaging Integration
Testing of Advanced Packaging Integration
Modeling of Advanced Packaging Integration
Roadmap Discussion of Advanced Packaging in China
Challenges of Advanced Packaging Development in China




Executives, Experts, engineers, researchers, scholars related to auto-motive electronics design, manufacturing and service

Oral Presentation Materials :
SCC 2014 PPT Template

 
Moderator 
1

Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai

  
13:00 - 13:10Opening Remark
Tom Salmon
Vice President, Global Member Services & Standards, SEMI
  
13:10 – 13:40The evolvement of IC & packaging
1Dr. Ed Chang
Director, China Business Development, TSMC
  
13:40 – 14:103D Integration Opportunities and Plating Challenges
1Dr. Zhenqiu Liu
Director of Wet Process Engineering, TEL, USA
  
14:10 – 14:40New Opportunity of Advanced Packaging Process Equipment
1Peijun Ding
Vice president, Beijing NMC Co.,Ltd.
  
14:40 – 15:10Advanced CSP & Turnkey Solutions
1Fumio Ohyama
Deputy Chief Sales Officer, Tera Probe


Download
  
15:10 – 15:40Innovative Advanced Package Solutions for Mobile Application
1Chang-Yi (Albert) Lan
Senior Director, SPIL


 
  
15:40 – 16:10 3D-IC beyond smartphones
1Gregory Smith
VP of Teradyne, Computing & Communications Business Unit
Teradyne


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16:10 – 16:40Panel Level Packaging Technologies as Enabler for Innovative Mobile Devices
1Rolf Aschenbrenner
IEEE Fellow / Deputy Director, Fraunhofer IZM,


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16:40 -16:50Closing and lucky draw (Huawei P6S Smart Phone)




Mr. JY Zhang

Tel: 86-21-60278556
Email: jyzhang@semi.org

Ms. Stacy Zhang
Tel: 86-21-60278552
Email: stacy.zhang@semi.org.cn

 

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