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Chinese
2019年3月20-22日
上海新国际博览中心

专家委员会介绍

International Advisory Committee Members
       
Dr. T. C. Chen
Chair
IBM Fellow and VP, IBM T.J. Watson Research Center, USA
Dr. Minhwa Chi
Co-Chair
Senior VP, SMIC
       
Dr. Philip Wong
Co-Chair
Stanford University, USA
  Dr. Swami MATHAD
Co-Chair
Tech Consulting, USA
       
Dr. Georg Bednorz
Member
IBM Fellow, Nobel Laureate, Switzerland
Dr. Qingyuan Han
Member
Hans Consulting International, USA
       
Dr. Kinam KIM
Member
President and CEO, Samsung Institute of Advanced Technology, Korea
Mrs. Ying Shi
Member
ICMTIA, China
       
Dr. Hailing Tu
Member
GRINM, China
Dr. Shichang Zou
Member
Chinese Academy of Sciences, China
       
Dr. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
Dr. Shaojun WEI
Member
Professor, Tsinghua Universtiy, China
       
Dr. Chenming HU
Member
Professor, UC Berkeley, USA
   
       
       
Steering Committee Advisors
       
Mr. Lung Chu
President,SEMI China
Vice President,SEMI
Dr. Hiroshi IWai
Member
Tokyo Institute of Technology, Japan
       
Dr. Tomi T. Li
Member
National Taiwan Central University
Dr. David P. Huang
Member
VP, Pall Inc. USA
       
  Dr. Lod Lauwers
Member
VP, IMEC, Belgium
   
       
       
Conference Executive Committee Members
       
Dr. Ru Huang
Conference Chair, Symp-I Chair
Professor and Dean, Peking University, China
Dr. Cor Claeys
Conference Co-chair and Award Selection Chair
Professor, KU Leuven, Belgium
       
Dr. Hanming Wu
Conference Co-chair
VP, SMIC, China
Dr. Kafai Lai
Symp-II Chair
Sr. Engineer, IBM, USA
       
Dr. Ying ZHANG
Symp-III Chair
VP, Applied Materials, USA
Dr. Zhen Guo
Symp-IV Chair, Conference Co-Chair
Principle Engineer/Sr. Manager, Intel, USA
       
Dr. Xinping Qu
Symp-V Chair
Professor, Fudan University, China
Dr. Peilin Song
Symp-VI Chair, Conference Co-Chair, Publicity Chair
Manager, IBM T.J.Watson Research Center, USA
       
Dr. Steve X. Liang
Symp-VII China, Conference Executive Co-Chair
VP and CTO of Jiangsu Changjiang Electronics Technology
Dr. Qinghuang Lin
Symp-VIII Chair, Conference Executive Co-Chair
Sr. Manager, IBM T.J.Watson Research Center, USA
       
Prof. Wenjian Yu
Symp-IX Chair
Associate Professor, Tsinghua University, China
Dr. Hsiang-Lang Lung
Poster Chair
Director MXIC, Taiwan
       
       
Symposium I: Device Engineering and Technology
       
Dr. Ru Huang
Chair
Peking University, China
Dr. Cor Claeys
Co-Chair
KU Leuven, Belgium
       
Dr. Minhwa Chi
Co-Chair
SMIC, China
Dr. Chung Lam
Co-Chair
Principle Engineer, IBM, USA
       
Prof. Jong-Ho Lee
Co-Chair
Seoul National University, Korea
Prof. Ming Liu
Co-Chair
IME, CAS, China
       
Prof. Yimao Cai
Member
Peking University, China
Prof. Mario Lanza
Member
Soochow University, China
       
  Dr. Kinyip Phoa
Member
Intel, USA
Dr. Wensheng Qian
Member
Director, HHGrace
       
Dr. Huiling Shang
Member
TSMC
  Prof. Xinran Wang
Member
Nanjing University, China
       
Dr. Zhiqiang Wei
Member
Panasonic, Japan
Dr. Hong Wu
Member
Director, Technology R&D, SMIC, China
       
Prof. Huaqiang Wu
Member
Microelectronics, Tsinghua University, Beijing, China
Dr. Frank Bin Yang
Member
Qualcomm, USA
       
Prof. Peng Zhou
Member
Fudan Univeristy, China
   
       
       
Symposium II: Lithography and Patterning
       
Dr. Kafai Lai
Chair
IBM, USA
Dr. Linyong (Leo) Pang
Co-Chair
VP. D2S Inc.
       
  Dr. Ken Wu
Co-Chair
SMIC, China
Mr. Xiaoming Ma
Member
Dow Chemical
       
Dr. Zhimin Zhu
Member
Brewer Science, USA
  Dr. Zhibiao Mao
Member
Nata Chemicals
       
Dr. Yayi Wei
Member
IMECAS, China
Mr. Motokatsu.Imai
Member
今井 基勝, 水戸工業(株)
       
Dr. Hai Deng
Member
Fudan University, China
Dr. Wang Yueh
Member
Intel, USA
       
Dr. Shiyuan Liu
Member
Huazhong University of Science and Technology , China
Dr. Yuyang Sun
Member
Mentor Graphics,USA
       
Dr. David H. Wei
Member
ASML Brion
Dr. Chris Progler
Member
Photronics
       
       
Symposium III: Dry &Wet Etch and Cleaning
       
Dr. Ying ZHANG
Chair
Applied Material, USA
Dr. Maxime Darnon
Co-Chair
French Institute for Scientific Research (CNRS), France
       
Dr. Tom Ni
Member
AMEC, China
Mr. Jinrong Zhao
Member
North Microelectronics, China
       
Dr. Sebastian Engelmann
Member
IBM T.J.Watson Research Center, USA
Dr. Steven Zhang
Member
SMIC, China
       
Dr. Kaidong Xu
Member
IMEC, Belgium
Dr. Ying Huang
Member
Applied Material, China
       
  Dr. Huiyuan Pei
Member
Lam Research, China
Dr. Wendy Yan
Member
IBM, Thomas J. Watson Center, USA
       
  Dr. Kevin Zhou
Member
Applied Materials, USA
   
       
       
Symposium IV: Thin film, Plating and Process Integration
       
Dr. Zhen Guo
Chair
Intel, China
Dr. Beichao Zhang
Co-Chair
SMIC, China
       
Mr. Xiaoping Shi
Co-Chair
Beijing Naura Microelectronics, China
Dr. Chao Zhao
Co-Chair
IMECAS, China
       
Dr. Huang Liu
Co-Chair
GLOBALFOUNDRIES, USA
Dr. Jiang Yan
Co-Chair
IMECAS, China
       
Dr. Ran Liu
Co-Chair
Fudan University, China
Dr. Sowmya Krishnan
Co-Chair
SEMITRAC, USA
       
  Dr. Ning Cheng
Member
Intel, USA
Dr. Jon REID
Member
Lam Research, USA
       
Prof. Yu-Long Jiang
Member
Fudan University, Shanghai
Dr. Li-Qun Xia
Member
AMAT, USA
       
Dr. Julian Hsieh
Member
ASM, Taiwan
Dr. Chih-Chao Yang
Member
IBM Research
       
Dr. Jianhua Ju
Member
Assistant Director, SMIC Tech R&D
Dr. Massayasu Tanjyo
Member
Nissin Ion Equipment, Japan
       
  Dr. Ganming Zhao
Member
Applied Materials
Dr. Zheyao Wang
Member
Tsinghua University, China
       
Dr. Da Zhang
Member
Higon, USA
Dr. Larry Zhao
Member
Lam Research, USA
       
Dr. Jiaxiang Nie
Member
Lam Research, China
   
       
       
Symposium V: CMP and Post-Polish Cleaning
       
Dr. Xinping Qu
Chair
Fudan University, China
Dr. Yuchun Wang
Co-Chair
Anji Microelectronics, China
       
Dr. Jingxun Fang
Co-Chair
Huali Microelectronics Corporation, China
Dr. Kuochun Wu
Co-Chair
Cabot Microelectronics, Asia
       
Dr. Paul-Chang Lin
Member
SMIC, China
Dr. David P. Huang
Member
VP, Pall Corporation, USA
       
Dr. Jin-Goo Park
Member
Hanyang University, Korea
Dr. Kailiang Zhang
Member
Tianjin University of Science & Technology, China
       
Dr. Mahadevaiyer Krishnan
Member
IBM, USA
Dr. Shoutian Li
Member
Anji Microelectronics, China
       
Dr. XinChun Lu
Member
Professor,Tsinghua University , China
  Dr. Wen-Chiang Tu
Member
Applied Materials, USA
       
Dr. Chao-Chang Arthur Chen
Member
NTUST, Taiwan, China


       
       
Symposium VI: Metrology, Reliability and Testing
       
Dr. Peilin Song
Chair
IBM, USA
Dr. Baozhen Li
Co-Chair
IBM System and Technology Group, USA
       
Dr. Frank Feng
Member
Mentor Graphics Corporation, America
Dr. Yiping Xu
Member
Sr.Vice President ahd CTO,Raintree Technologies Corp
       
Dr. Yuhua Cheng
Member
Peking University, China
Dr. Francis Jen
Member
KLA Tencor, China
       
Dr. Kelvin Xia
Member
Advantest, China
Dr. Srinivas Raghvendra
Member
Synopsys, USA
       
Dr. Xiaowei Li
Member
IMECAS, China
Dr. Yu Huang
Member
Mentor Graphics, USA
       
Dr. Jian-fu Zhang
Member
Liverpool John Moores University, England
Dr. Houken Tseng
Member
Teradyne, Greater China,China
       
Dr. Yu Zhu
Member
Department Manager, TSMC
  Dr. Ye Feng
Member
Technical Director, Lam Research, USA
       
       
Symposium VII: Packaging and Assembly
       
Dr. Steve X. Liang
Chair
Jiangsu Changjiang Electronics Technology Co., Ltd, China
Dr. Yifan Guo
Co-Chair
VP of Engineering, ASE Shanghai
       
Dr. Huili Fu
Co-Chair
Chief Packaging Expert, HiSilicon
Dr. Mark Huang
Member
SuZhou Speed Semiconductor, China
       
Prof. Mingliang Huang
Member
Dalian University of Technology, China
Prof. Kuan-Neng Chen
Member
Professor, National Chiao Tung University
       
Dr. Shin-Puu Jeng
Member
Director, TSMC
  Prof. Xing Wu
Member
Professor, East China Normal University
       
Prof. Wenhui Zhu
Member
Professor, Central South University
  Mr. John Rowland
Member
VP of Engineering,Spreadtrum
       
Dr. John Yuanlin Xie
Member
Altera Corp., CA, USA
Dr. Roy Yu
Member
IBM, Watson Research Center, USA
       
Dr. Yishao Lai
Member
ASE. Taiwan, China
Dr. Jing Shi
Member
Oracle, USA
       
Dr. Young Do Kweon
Member
Samsung, Korea
Dr. Renzhe Zhao
Member
Huawei, China
       
  Dr. Hong SHI
Member
Xilinx
Dr. Tim Bao
Member
Air Products and Chemicals, Inc
       
Dr. Tim Chen
Member
Yantai Darbond Technology Co., Ltd.
Dr. Daniel Lu
Member
Henkel
       
Dr. Wang Su
Member
CTO of Shanghai Sinyang Semiconductor Materials Co., Ltd.,
and chairman of the board of Sinyang Semiconductor (Shanghai)
Technology and Innovation Co., Ltd.
   
       
       
Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies
       
Dr. Qinghuang Lin
Chair
IBM, USA
Prof. Hyungjun Kim
Co-Chair
Yonsei University, South Korea
       
Dr. Hsiang-Lang Lung
Co-Chair
Macronix International Ltd., Hsinchu, Taiwan
Prof. Jingwei Bai
Member
Tsinghua University, China
       
Prof. Edward Y. Chang
Member
National Chiao Tung University, Taiwan, China
Dr. Kangguo Cheng
Member
IBM, USA
       
Prof. Jinn P. Chu
Member
National Taiwan University of Science and Technology, China
Prof. Thomas Otto
Member
Acting Director of the Fraunhofer Institute for Electronic Nano Systems ENAS, Chemnitz, Germany
       
Prof. Zheyao Wang
Member
Tsinghua University, China
Prof. Daniele Lelmini
Member
Politecnico Di Milano, Italy
       
Prof. Wei Wang
Member
Peking University, China
Prof. Fuhua Yang
Member
Institute of Semiconductor, Chinese Academy of Sciences, China
       
Dr. Wang Yueh
Member
Intel, USA
Prof. Zhen Zhang
Member
Uppsala University, Sweden
       
       
Symposium IX: Design and Automation of Circuits and Systems
       
Prof. Wenjian Yu
Chair
Associate Professor, Tsinghua University, China
Prof. Cheng Zhuo
Co-Chair
Professor, Zhejiang University, China
       
Prof. Weikang Qian
Co-Chair
Assistant Professor, University of Michigan-Shanghai Jiao Tong University Joint Institute, China
Prof. Yiyu Shi
Member
Professor, University of Notre Dame, USA
       
Dr. Dong Chen
Member
IBM T.J. Watson Research Center, USA
Dr. Jinjun Xiong
Member
IBM T.J. Watson Research Center, USA
       
Prof. Yu-Guang Chen
Member
Associate Professor, Yuan-Ze University, Taiwan, China
Prof. Baoyong Chi
Member
Tsinghua University, China
       
Prof. Yinhe Han
Member
Professor, Chinese Academy of Science, China
  Dr. Li Li
Member
Synopsys Inc., Shanghai
       
  Dr. Bing Li
Member
Technical University of Munich, Germany
Prof. Shaojun Wei
Member
Professor, Tsinghua University, China
       
Prof. Le Ye
Member
Peking University, China
  Prof. Xiaoyang Zeng
Member
Fudan University
       
Prof. Pingqiang Zhou
Member
Shanghai Tech University
  Prof. Chuan Zhang
Member
Associate Professor, Southeast University
       
Prof. Wanyuan Qu
Member
Zhejiang University
   
       
       


Conference Questions   Sponsorship Contact  
       
April Peng, SEMI China Cheryl Qiu, SEMI China June Wu, SEMI China  
Email: apeng@semichina.org Tel: 86.21.6027.8552 Tel: 86.21.6027.8523  
  Fax: 86.21.6027.8511 Fax: 86.21.6027.8511  
  Email: cheryl.qiu@semichina.org Email: jwu@semi.org