Dr. Yishao Lai
ASE. Taiwan, China

Yi-Shao Lai received the Ph.D. degree in engineering mechanics from The University of Texas at Austin in 2002, and M.S and B.S. degrees in civil engineering from National Central University, Jhongli, Taiwan. He is currently pursuing an M.S. degree in engineering management at National Cheng Kung University, Tainan, Taiwan. Dr. Lai is a Director with Group R&D of Advanced Semiconductor Engineering (ASE), Inc., where he is leading Central Product Solutions with research and development focusing on manufacturing process innovations, thermal and reliability issues, and material characterizations of electronic packaging components. Dr. Lai is an Adjunct Assistant Professor with National Sun Yat-sen University. He is a Board Member of IMAPS Taiwan and Chair of the iNEMI Technology Working Group for Modeling, Simulation, and Design Tools. He is an Associate Editor for Microelectronics Reliability, a Guest Editor for IEEE Transactions on Components and Packaging Technologies, the Editor for ASE Technology Journal, and serves on the Editorial Advisory Board of Recent Patents on Electrical Engineering. Dr. Lai is an IEEE Senior Member. He was named Outstanding Young Engineer by Electronic & Photonic Packaging Division of American Society of Mechanical Engineers (ASME EPPD), Chinese Institute of Engineers, and Chinese Society of Mechanical Engineers. Dr. Lai has over 500 technical publications and is the inventor of more than 40 patents.