功率及化合物半导体产业国际论坛 2024



日期: 2024年3月21-22日 周四-周五
地点: 上海浦东嘉里大酒店, 浦东厅 1
地址: 上海市浦东新区花木路1388号
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The "Power & Compound Semiconductor International Forum 2024", which is one of the largest professional events about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2024 on Mar 21-22, 2024 in Kerry Hotel at Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.

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Day 1- Mar.21st, 2024
   
08:30-09:20 Registration / 注册
   
09:20-09:30
Welcome Remark / 欢迎致辞
Lung Chu 居龙
Vice President, SEMI; President, SEMI China
SEMI全球副总裁、中国区总裁
   
Moderator / 主持人:
David Xiao, Board Chair of AccoPower
肖国伟,广东芯聚能半导体有限公司,董事长
   
09:30-09:55
MicroLED Technology Entering Mass Production: Opportunities and Challenges in The New Era
MicroLED技術的量產:機會與挑戰的新時代

李允立,錼創科技,董事长
Dr. Yun-Li (Charles) Li, Chairman of PlayNitride Inc.
   
09:55-10:20
大尺寸SiC单晶衬底制备
杨昆,河北同光半导体股份有限公司,总工程师
   
10:20-10:45
How Power and Compound Semiconductor Drive Sustainable Innovation
功率和化合物半导体如何推动可持续创新

Francesco MUGGERI, VP of Power Discrete & Analog Products, APeC&China, STMicroelectronics
Francesco MUGGERI,意法半导体,亚太区功率分立和模拟产品器件部市场和应用副总裁
   
10:45-11:10
Compound Semiconductor Infrared Measurement Technology and Equipment
化合物半导体红外量测技术与设备

任杰,盖泽华矽半导体科技(上海)有限公司,总经理&首席执行官
   
11:10-11:35
Lam Reaserch
Dr David Haynes, VP Strategic Marketing of Lam Research Corporation
   
11:35-13:30 Break / 休息
   
Moderator / 主持人:
Rong Xuan, CEO of Best Compound Semiconductor Co., Ltd.
宣融,南京百识电子科技有限公司,总经理
   
13:30-13:55
Development of Silicon Carbide Epitaxy and Wafer Manufacturing Technology
碳化硅外延与晶圆技术发展

Rong Xuan, CEO of Best Compound Semiconductor Co., Ltd.
宣融,南京百识电子科技有限公司,总经理
   
13:55-14:20
TBD
Jiangbo Wang, VP&CTO of HC SemiTek Corporation
王江波,华灿光电股份有限公司,副总裁&CTO
   
14:20-14:45
Demand Leadership, Technological Innovation, Building a New Ecosystem for China's Power and Compound Semiconductor Industry
需求引领,技术创新,构建中国功率及化合物半导体产业新生态

李仕群,北京北方华创微电子装备有限公司,行业总经理
北京北方华创微电子装备有限公司
   
14:45-15:10
Ion Implantation and Applications for Power Device
Causon Ko-Chuan JEN, Ph.D. SVP, Technical Marketing, Axcelis Technologies,Inc.
   
15:10-15:35
Ahead of What’s Next with ASM’s Silicon Carbide Epitaxy
ASM 碳化硅外延技术赋能未来

Krishna Sreerambhatla, Vice President, Head of SiC Epitaxy business, ASM
Krishna Sreerambhatla, ASM副总裁,SiC外延业务负责人
   
15:35-16:00
Applications of Laser Technology in Power and Compound Semiconductor Industries
激光技术在功率及化合物半导体产业的应用

巫礼杰,深圳市大族半导体装备科技有限公司,技术副总经理
   
16:00-16:25
Advanced Sinter Solutions from Heraeus Electronics
先进烧结解决方案

Dr.Jing Zhang, Heraeus Materials Technology Shanghai Ltd, Head of Shanghai Innovation Center, Heraeus Electronics China
张靖,上海贺利氏工业技术材料有限公司,贺利氏电子中国研发总监
   
16:20-16:45
Thermo Fisher
Xiaoxiao Cao, Senior Business Development Manager, PFA, Thermo Fisher Scientific
曹潇潇,赛默飞世尔,高级业务拓展经理
   
16:45-17:10
Ultra Fast Laser Technology Combined with AI Empowers Extreme Manufacturing of Compound Semiconductors
超快激光技术叠加AI赋能化合物半导体极端制造

Haoquan Fang, MegaRobo Technologies, Vice General Manager of Semiconductor Business Unit
方浩全,镁伽科技,半导体事业部副总经理
   
Day 2 - Mar.22nd, 2024
   
Moderator / 主持人:
徐伟,广东芯粤能半导体有限公司,总经理
   
10:00-10:25
TBD
Gilbert Zhou, President of AccoPower
周晓阳,广东芯聚能半导体有限公司,总裁
   
10:25-10:50
大尺寸碳化硅单晶衬底制备技术挑战及进展
高超,山东天岳先进科技股份有限公司,CTO
   
10:50-11:15
SiC Wafer Polishing Process and Prediction of Its Developing
碳化硅晶片抛光工艺及其发展预测

王永成,上海致领半导体科技发展有限公司,总经理
   
11:15-11:40
芯联集成电路制造股份有限公司
   
11:40-12:05
Thermo Fisher
Michael Lee, Semiconductor Measurement Manager of Thermo Fisher Scientific
李云鹏,赛默飞世尔,半导体晶圆材料量测负责人
   
12:05-13:30 Break / 休息
   
Moderator / 主持人:
Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯,苏州晶湛半导体有限公司,董事长、总裁
   
13:30-14:00
GaN Progress on Large Size of Substrates
大尺寸GaN材料的新进展

Kai Cheng, Board Chair&President of Enkris Semiconductor, Inc.
程凯,苏州晶湛半导体有限公司,董事长、总裁
   
14:00-14:25
Accelerating Si, SiC & GaN Power Devices’ PPACt (Power, Performance, Area, Cost, Time to Market) Scaling
加速 Si, SiC 以及 GaN 功率器件的PPACt (功率,性能,面积,成本,产品上市时间) 技术迭代

Dr. Yi Zheng, Senior Director, ICAPS, Applied Materials
郑毅,应用材料公司ICAPS事业部高级总监
   
14:25-14:50
Integrated Etch & Deposition Solutions Enabling Compound Semiconductor Power Devices High Volume Manufacturing
刻蚀-沉积一体化赋能化合物半导体功率器件的大规模制造

Dr. Wuping Liu, VP of Customer Applications & Technology of Jiangsu Leuven Instruments Co., Ltd.
刘武平,江苏鲁汶仪器股份有限公司,产品研发中心副总经理
   
14:50-15:15
High Throughput Epitaxy Solution for Compound Semiconductors
化合物半导体的高产能外延解决方案

Ziwen Fang, Vice General Manager of AIXTRON China
方子文,德国爱思强股份有限公司,中国区副总经理
   
15:15-15:40
onto innovation
   
15:40-15:50 Lucky Draw 幸运抽奖
   


两天会议注册费:
类型 提前注册并付费(3月1日之前) 注册费(3月1日之后)及现场付费
听众 RMB 1,000/位 RMB 1,500/位
讲师 Free Free
* 注册费不含午餐
* 议程变化恕不另行通知


联系方式 / Contacts:
徐天天 / Robin Xu 李晓倩 / Cassie Li 冯莉 / Lily Feng
Tel: 021.6027.8553 Tel: 021.6027.7645 Tel: 021.6027.8546
Email: [email protected] Email: [email protected] Email: [email protected]