Advanced Packaging Forum - Heterogeneous Integration
| Date: | Thursday, March 21, 2019 |
| Venue: | Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai |
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The challenge to achieve higher performance, smaller size, higher reliability and lower power consumption for electronic chips and products are driving the advanced packaging forward in these days.AI, Autonomous Car, 5G, IoT and other new applications are enabling a new vision era of advanced packaging technologies-Heterogeneous Integration.
In this forum, experts from leading Heterogeneous Packaging and Testing, Equipment and Materials supplier are invited to share their treasure experiences on future technology development roadmap, challenges and packaging solution.
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Moderator / 主持人 Dr. Huili Fu 符会利 Senior Technical Advisor, Huawei 华为，高级技术顾问 |
13:00-13:10
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Welcome and Introduction / 欢迎致辞 Lung Chu 居龙 President, SEMI China SEMI，全球副总裁、中国区总裁 |
13:10-13:35
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Development of Advance SiP Technology and Applications 先进SiP技术的开发和应用 Dr. Steve Liang 梁新夫 Senior Vice President, JCET 江苏长电科技，高级副总裁 |
13:35-14:00
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Heterogeneous Product Customization：More than Moore Integration 异构产品定制：超越摩尔的集成方案 Xuewu Gao 高学武 Corporate Vice President, Mediatek Inc. 聯發科技，副總經理 |
14:00-14:25
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New Interconnection in Advanced Packaging - Fan Out 先进封装最新内连接技术——扇出型封装 Oscar Feng 冯耀信 Senior Director, ASE 日月光集团，资深处长 |
14:25-14:50
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The development of formulated cleans for enabling packaging processes 开发引领先进半导体封装的湿法蚀刻和清洗液 Dr. Tianniu (Rick) Chen 陳天牛 Vice President of Global SP&C, Versum Materials 慧瞻材料科技，全球表面清洗和处理副總裁 |
| 14:50-15:00 | Break / 休息 |
15:00-15:25
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Packaging Integration - A Complementary Solution to CMOS Scaling 利用封装集成技术应对CMOS缩微调整 Russell LIU 刘宏钧 VP, Marketing and BD, WLCSP 苏州晶方半导体，市场和业务拓展副总裁 |
15:25-15:50
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Heterogeneous Integration for SiP SiP异构集成 Jensen Tsai Director, SPIL 矽品，总监 |
15:50-16:15
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Increasing Strategic Relevance of Advanced Packaging for Next-Generation Semiconductor Devices 先进封装对下一代半导体器件开发密切相关 Manish Ranjan Managing Director, Advanced Packaging Customer Operations, Lam research 泛林半导体，先进封装客户运营，董事总经理 |
16:15-16:40
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Heterogeneous Integration Roadmap 异构集成路线图 Jan Verdaman President, TechSearch International |
| 16:40-16:50 |
Lucky Draw, Sponsored by PhiChem Materials (Mate 20 Pro) 观众抽奖，由飞凯材料特别赞助 (Mate 20 Pro) |
| 16:50-16:55 | Closing Remark / 闭幕词 |
* 议程变化恕不另行通知
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