Oscar Feng
Senior Director, ASE


Oscar Feng is currently the Senior Director of customer engineering at ASE Group in Kaohsiung, responsible for US region customer and SiP business development. He has over 20 years of research and manufacturing experience in the field of IC packaging, including advanced package development, memory packaging and SiP module integration and business development.

In 1998, he joined the R&D of ASE Group and responsible for advanced technologies development including bumping, flip chip as well as wire bond packaging. He spent 10 years to build up 8" and 12" Bumping, and WLP front-end and back-end from Prototype into high volume production. From 2008, he was assigned to develop US region customers with significant revenue growth. Current he focuses on US region customer engineering and SiP business development for all regions.

Oscar has received the B.E. and Master degree in Mechanical Engineering of National Sun Yet-Sun University, Kaoshiung, Taiwan.