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March 20-22, 2019
Shanghai New International Expo Centre

2019 New technology release conference

2019 New technology release conference

Date: Wednesday, March 20, 2019
Venue: New Tech Stage, Hall E7, Shanghai New International Expo Centre

Attendee Registration   Previous Review

After the first successful event in 2018, SEMI will hold "2019 New Technology Release Conference" at Shanghai New International Expo Centre E7 Hall on March 20, 2019.
This conference is divided into two themes:packaging and test technology, wafer manufacturing and materials technology.
No matter innovative semiconductor solutions, new equipment, new materials or new services, they can be promoted to the global semiconductor industry and media through the efficient and direct platform of "2019 New Technology Release Conference" and then achieve the expected effect. The conference is expected to be attended by about 250 professional audience and many media.

Sponsors:  
   
Agenda / 议程
   
10:00-10:30 Registration 来宾登记
   
  Theme: packaging and test technology
主题:封装测试技术
   
Moderator / 主持人
Jianzhong Wu 吴建忠
华润安盛科技有限公司副总经理
   
10:30-10:45
Topic: High Thermal Die Attach for Power & RF
功率和射频器件的高导热芯片粘接解决方案

Dr. Wei Yao 姚伟 博士
Scientific Associate, Henkel Adhesive Technologies – Electronics
汉高电子材料集团,产品研发经理
   
10:45-11:00
Topic: Rejuvenating UK Brand's Wafer Dicing Machine
重焕青春的英伦品牌晶圆切割划片机

Jianxin Zhang 张健欣
Director & Vice President, Gl Tech Co., Ltd
光力科技股份有限公司,董事兼副总经理
   
11:00-11:15
Topic: Conference of Huatian "Embedded System in Chip technology"
华天科技“eSinC®集成技术”发布会

Dr. li Ma 马力
Director of advanced package, Huatian Technology (Kunshan) Electronic Co.
华天科技(昆山)电子有限公司,先进封装研发总监
   
11:15-11:30
Topic: One-Stop ATE Test Platform
一站式ATE测试平台

Jin Pan 潘津
CTO, Suzhou HYC Technology Co., LTD
苏州华兴源创科技股份有限公司,CTO
   
11:30-13:00 Break 休息(午餐自理)
   
  Theme:wafer manufacturing and materials technology
主题:晶圆制造及材料技术
   
Moderator / 主持人
Junyu Xie 谢均宇
vice general manager, Beijing Zhongkexin Electronics Equipment Co., Ltd
北京中科信电子装备有限公司,副总经理
   
13:00-13:15
Topic: New Deposition Materials for Emerging Semiconductor and Other Applications
用于新兴半导体和其他应用的新型沉积材料

Dan Tracy
Senior Director, Techcet
Techcet, 总监
   
13:15-13:30
Topic: 2019----ATEN宏正助力智能化产线
Lei Zhou 周雷
Technical director of China, ATEN
ATEN, 中国区技术总监
   
13:30-13:45
Topic: Real Time Process Monitoring in CMP, Post CMP Clean Blending and Distribution Applications
CMP工艺实时监测与CMP后清洗液的混配和输送应用

Karl Urquhart
Diversified Fluid Solution's Director of R&D | Chemical Product Technology Manager, PHOCUS-DFS
厦门积光合作伙伴--美国DFS, 研发技术总监 | 化学品技术经理
   
13:45-14:00
Topic: One of the best equipment manufacturers in the world: Kanken Techno's Abatement Solutions
Phd. TSUTOMU TSUKADA 塚田 勉
Head of technology department, Kanken Techno Co., Ltd.
日本康肯技术有限公司,技术部 部长
   
14:00-14:15
Topic: A Complete Insight on ECD Process Control
全面洞察电化学沉积的过程控制

Dr. Kaz Wikiel 卡兹•维基博士
Vice President, Technic, Inc
得力有限公司,副总裁
   
14:15-14:30
Topic: Solvay Material Solution for reducing micro-contamination in Wet processing Equipment
索尔维为湿法制程设备提供有效减少微污染的材料解决方案

Karl Kim
Global Marketing Manager for Semiconductor, Solvay Specialty Polymers
索尔维特种聚合物,半导全球市场经理
   
14:30-14:45
Topic: Disruptive Technology in Through Glass Via (TGV) Drilling and Processing
玻璃纤维通过(TGV)钻孔和加工中的破坏性技术

Sergey Savastiouk, Ph.D
CEO, ALLVIA, Inc.
ALLVIA, 首席执行官
   
14:45-15:00
Topic: The importance of silicon parts for advanced wafer fabrication processes
精密硅部件材料在先进晶圆制程中的重要作用

Kevin Xia 夏秋良
General manager, SICREAT Nanotech
苏州新美光纳米科技有限公司,总经理