Dr. Wei Yao
Scientific Associate, Henkel Adhesive Technologies – Electronics

Biography

2003-2012, Ph.D. degree from Nanjing University
    Major in Polymer Chemistry and Physics.
    Research about the self-assembly of macromolecule.

2012, Joined Henkel Adhesive Technologies – Electronics – Semiconductor.
    Focus on Semi-sintering, Silicone system.

Abstract

Henkel provides different solutions for Power & RF applications
  •  Developing semi-sintering die attach paste for Higher power and high reliability package.
  •  Upgrading existing die attach paste to enable higher reliability.
  •  Developing new CDF to enable high reliability and Miniaturization.