Date: Monday, March 12, 2018
Venue: Shanghai International Convention Center
Room: 5H
IC Packaging Technology Development – Current Status and Trend
Dr. Yifan Guo
Vice President of Engineering, ASE Shanghai

Introduction of IC Technologies and Applications
• Principle of IC Packaging
• Design and Process in Advanced IC Packaging Technology
• Future Trend in IC Packaging Technology Development
IC Packaging Reliability
Alex Xu
Deputy General Manager of Quality Test Center, Jiangsu Changjiang Electronics Technology Co., Ltd (JCET)

Tutorial 1  Agenda