Dr. Yifan Guo
Vice President, ASE Group
IEEE Fellow

Dr. Yifan Guo is currently Vice President of Engineering at ASE Group overseeing the engineering, research and development teams for IC assembly and package technology. He received IEEE fellow for the leadership in interconnect technologies for electronics packaging and reliability analysis and has 30 years of research and manufacturing experience in the field of IC packaging, including optoelectronic devices, MEMS, Flip Chip and Wafer Level Packaging (WLCSP) and SiP module assembly.

Prior to joining ASE, Dr. Guo worked at Skyworks, IBM and Motorola respectively.

Dr. Guo has published more than 40 papers in renowned scientific journals and more than 50 papers in proceedings of international conferences. He has collaborated with industry experts and professors to publish 7 professional literature and high education textbooks. He currently holds 9 patents, and has another 2 under application.

Dr. Guo has a Ph.D. degree in engineering science and mechanics from the Virginia Polytechnic Institute & State University, and also earned an MBA degree from the School of Business, Redlands University.