Dr. Jun He 何军 博士
Vice President of Quality and Reliability, TSMC
质量暨可靠性副总经理，台积电

个人简介 / Biography

Education:

Ph.D. in Materials Science, University of California, Santa Barbara, USA

Experience:

Senior Director, Advanced Technology Quality and Reliability, TSMC

Senior Director, Head of Quality and Reliability for Technology & Manufacturing Group, Intel

Dr. Jun He is Vice President of Quality and Reliability at Taiwan Semiconductor Manufacturing Co. Ltd. (TSMC). His responsibility spans across TSMC foundry eco-system, such as incoming materials qualification, reliability and certification of new process technology & design IP, manufacturing quality as well as enabling customers for their product qualification and ramp. Prior to this role, Dr. He was Senior Director of Advanced Technology Quality & Reliability Division at TSMC. Since joining the Company in 2017, he has been leading the development of analytical and test methodology to effectively detect reliability defects and screen problematic products. Such innovations accelerated launch and steep production ramp for 7nm and 5nm technologies. Dr. He also revamped TSMC’s quality management system for incoming materials in 2019 and strengthened collaborative relationship with key suppliers.

Prior to joining TSMC, Dr. He was a senior director at Intel Corporation, leading overall quality and reliability of process technology development and manufacturing. His scope included research & development of Si, advanced packaging and test along with Intel worldwide manufacturing operations. Dr. He is a three-time winner of Intel Achievement Awards, the highest technical accomplishments at the company, for his technical leadership on low-k dielectric integration, assembly defect detection and development of advanced one-time programmable read-only memory.

Dr. He holds 36 patents globally, including 28 U.S. patents and published over 50 papers in international conferences and peer-reviewed technical journals. He received his B.S. degree in Physics and Ph.D. in Materials Science from University of California, Santa Barbara.

摘要/ Abstract

The semiconductor industry is becoming an indispensable element of our daily life. Any large-scale quality/reliability excursions or supply disruptions in semiconductor products could potentially affect our society significantly. Therefore, it is our industry’s joint responsibility to focus on business continuity and manufacturing quality. However, as the technology node continues to shrink, the process window of semiconductor manufacturing is getting much tighter, and small fluctuations in raw materials may directly impact semiconductor product or line stability. Chipmakers have to work together with material suppliers to improve the quality of raw materials including their upstream components to ensure variations are within downstream process tolerance. TSMC is committed to collaborate with material industry on defect detection, process control, material characterization and business continuity management to advance industry’s material quality system. In parallel, for material batches deviating away from baseline, we will also run qualification through a quarantined fab process line in attempt to continue enlarge acceptance window. We strongly believe in this win-win partnership. Together, we can continue make “technical impossible” possible and fulfill social responsibility expected upon our industry.