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Summary
• 20 years of experience in advanced packaging industry, including 7 years experience
in Fan-out WLP development and 3 years development in 3D-IC
packaging
• Very good knowledge in process, design and engineering management.
• Very good knowledge in various advanced packaging such as WLP, 3D-TSV,
Fan-out WLP and optical sensor.
• Very good experienced in project management such as start up, factory setup
and technology transfer.
• 30 USA Patents and 11 Chinese Patents.
• Major achievement: 3D Fan-out WLP and its application for optical sensor
package; 1st Large panel FOWLP in the world; Very Large FO package with
very good reliability.
Experience
CEO (May 2022-Pre) OIP Technology
Senior managers in MNC company, including STMicroelectronics and Apple Singapore
in the past 15 years.
• 7 years experience in R&D team, filed 20 US patents and publish 13 papers.
• 8 years experience in Operations, bring up 5 production line to mass production.
• Familiar with product design, process integration.
Senior engineers in local Singapore company btw 1996-2007.
•Familiar with semiconductor advanced packaging process, set up production
line in Singapore, and successfully transferred technology to Singapore.
Education
1990–1994 Huazhong University of Science and Technology (China)
Bachelor of Material Science and Engineering.
2001–2004 National University of Singapore (Singapore)
Master of Material Science
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