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Ben Zongbin Wang is Director of Process Engineering at Applied Materials and KPU Head for Advanced Packaging in the Dielectric Deposition Product Business Unit, developing CVD product portfolios that enable key advanced packaging inflections in TSV, 3DIC, hybrid bonding, and heterogeneous integration. Ben oversees end‑to‑end product strategy and execution—spanning materials engineering, thin‑film process and hardware development, and integration validation—to advance performance, reliability, and manufacturability for next‑generation advanced packaging technologies.
Over his 12‑plus years at Applied Materials, Ben has progressed through senior technical and leadership roles, partnering closely with customers and ecosystem collaborators to solve high‑value problems and deliver scalable solutions.
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