Appointed Vice President
General Manager Core Packaging Products
Semiconductor Products Group
Applied Materials, Inc.

Len Tedeschi is vice president and general manager, Core Packaging Products at Applied Materials. Len is directly responsible for the Metals Packaging Products (MPP), Packaging Plating & Cleans (PPC), Tango & Plasma Dicing, and Hybrid Bonding Interconnect product groups. His focus is ensuring customers are successful with their current products, while simultaneously solving customer’s future high value problems.

Len has worked at Applied for more than 20 years and has over 27 years of semiconductor experience in roles ranging from product development & support, productivity, technical strategy, marketing, and general management. Len has worked with a variety of products and technologies including etch, deposition, lithography, metrology, and inspection. Prior to joining Packaging, Len spent 14 years in Applied’s Etch Business Unit in a wide variety of customer focused positions. Len has more than 10 patents granted, mainly as the lead author.

Len began his career in 1995 as a lithography equipment engineer at IDT in Santa Clara, California. He earned a Bachelor of Science degree in industrial technology from San Jose State University in 1995, where he served as captain of the university’s judo team, winning two collegiate national titles, and competing in the 1996 Olympic Judo Trials.