|
Xiaolin Cai 蔡晓林 Applications Manager of KLA Corporation 产品应用经理，KLA Corporation |
|
讲师简介 / Speaker Bio 蔡晓林先生目前担任KLA Instruments部门的产品应用经理。晓林于2013年加入KLA公司，在化合物半导体晶圆缺陷检测方面具有丰富的经验。晓林参与了国内外多个重要客户的合作开发项目，针对应用于功率器件，射频器件，LED和通讯传感器件的化合物半导体材料缺陷检测有较深入的研究并基于客户需求开发应用。 |
|
|
摘要 / Abstract Semiconductors are the core of innovation in today’s automobiles. Automotive ICs are subjected to even more stringent reliability than other semiconductor applications. Safety is a paramount aspect to consider, besides function and performance when dealing with automobiles, therefore chip reliability is critical to both vehicle safety and function. Power devices used for automobile applications are subjected to these same stringent quality standards as other automotive ICs. Automobile chips are expected to work for long periods of time or more and chip reliability is an important aspect of extending chip lifetime. Wafer quality, processing capability and defectivity have a strong correlation to chip reliability and to meet automobility industry requirements, a ZERO DEFECT strategy needs to be adopted with a target to achieve ≤1 defect per million as a quality standard. KLA has a board portfolio of solutions to enable process development and achieve effective process control to meet this ZERO DEFECT strategy. With solutions covering semiconductor wafer processing, inspection and metrology needs, you will be able to inspect and find critical defects, measure critical process attributes and finetune your production processes to achieve yield targets to meet automobile reliability and safety requirements. |
|
