| ** | to designate keynote talk | Sponsored by: |
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| * | to designate invite talk | ||
| to designate regular talk |
Session I:
| Opening Remarks |
| Steve X. Liang |
| *Chiplet Cost Model Analysis, Opportunities and Challenges for Off-the-shelf Chiplets |
| Kaisheng Ma, Tsinghua University |
| Integration Strategy on Low-Cost Chip-First Fan-Out Panel Level Packaging |
| Cheng-Tar Wu, Chengdu ESWIN System IC Co., Ltd. |
| Development and Application of Electroplating Copper Products with Low or Zero Internal Stress |
| Peipei Dong, Suzhou Shinhao Materials LLC |
| Design and Fabrication of High-Q IPDs for Process Design Kits on Glass Substrate |
| Haozhe Ma, Xiamen University |
Session II:
| *Revent progress of laser induced TGV technology and it's applications |
| Daquan Yu, Xiamen University |
| Investigation on Yield Improvement of Fan-out Wafer-level Packaging |
| Kai Zhu, ZTE Corporation |
| Fine-pitch Cu-Sn transient-liquid-phase bonding based on reflow and pre-bonding |
| Yunfan Shi, Tsinghua University |
| Flip Chip Thermal Stress Induced ILD Crack & Failure Analysis |
| Suming Wang, TF-AMD |
| The study on warpage of epoxy molding compound |
| Yangyang Duan, Jiangsu HHCK Advanced Material Co. Ltd. |
Session III:
| *Application of Single Wet equipment in WLP |
| Yi Wang, KINGSEMI |
| State of the Art Metal Deposition System for Advanced UBM, RDL and Fan-Out Wafer Level Packaging |
| Clinton Goh, Applied Materials |
| Robust Electrostatic Discharge (ESD) Protection Solutions for Automotive Electronics |
| Juin J. Liou, Zhengzhou University |
Session IV:
| *Laser Release Material for wafer level Fan-out Applications |
| Guoping Zhang, Shenzhen Institute of Advanced Electronic Materials |
| Glass Carriers for Advanced Packaging |
| James Li, Corning Incorporated |
| Dielectric property design based on BaTi2O5 nanorods and BaTiO3 nanoparticles couple and its application in embedded capacitor |
| Wenzhong Zou, University of Electronic Science and Technology of China |
Poster Session:
| Optimization of Wafer Dicing-Saw to Reduce the Chipping Defect by using the Response Surface Methodology |
| Hong Zhang, School of Microelectronics, Fudan University, Shanghai |
| The research on small "dead zones" packaging technology for mass production of silicon photomultiplier |
| Yuxiao Liu, Beijing Normal University |
| Reliability Study of WLP for SAW Filter with TGVs vertical feedthrough |
| Zuohuan Chen, Xiamen University |
| Realization of Multi-layer Stacked Antenna Technology Based on Glass Wafer |
| Qing Zhou, Xiamen University |
| 2.5D & 3D IC HBM Interposer Auto Routing |
| Leqi Li, Sanechips Technology Co., Ltd |
| A SIMPLE METHOD FOR FINE VERTICAL INTERCONNECTION BY STENCIL PRINTED VIAS ON FLEXIBLE PRINTED CIRCUIT BOARD WITH LOW TEMPERATURE SINTERING NANO-SILVER PASTE |
| Xiang Xun, Institute of Semiconductors, Guangdong Academy of Sciences |