李春兴

江苏长电科技股份有限公司首席执行长

Choon Heung Lee博士（'Choon Lee'）目前是JCET的首席执行长。 他于2016年3月至2018年9月担任泛林（Lam Research）高级封装副总裁。在此之前，李博士于2013年12月至2015年11月担任安靠（Amkor Technology，Inc）的首席技术官。于 2015年2月至2015年11月期间担任全球制造业务执行副总裁兼安靠韩国总裁。

Lee博士还撰写了各种关于各种封装技术相关主题的研究论文，并在韩国获得38项专利，在美国获得21项专利。他拥有韩国大学物理学学士学位和统计物理学硕士学位，以及凯斯西储大学理论固体物理博士学位。

演讲摘要：

先进封装业的趋势转变

These days the importance of advanced packaging has ever been emphasized because of cost of advanced Si node and high density integration. Also markets such as smartphone, big data, automotive, IoT and memory have looked for the solutions from advanced packaging for various applications. The solutions include the platform of 2.5D in conjunction with fan-out schemes, 3D TSV in memory and SiP. In particular, as 5G is coming up in 2019, specific design knowledge and expertise in RF and antenna are required with smarter ideas in advanced packaging which will lead to new applications like AI/VR/AR/hologram. In this talk, paradigm change in industry, advanced packaging solutions, and AI related manufacturing will be discussed.