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1. Mr. Bo Wang

   ...p;     Developed algorithms for wafer defec...

   Basic page - 2024-02-05 14:55:55.0

2. Si Chen / 陈思

   ...olid #cccccc; } Si Chen 陈思 Director of Packaging System Enginee...

   Basic page - 2024-02-19 12:03:20.0

3. Weining Li / 李卫宁

   ...cc; } Weining Li 李卫宁 R&D Pilot Line Leader, SVP, SITRI 上海微技...

   Basic page - 2024-02-23 15:48:04.0

4. Poshun CHIU

   ...d 10 years’ experience in R&D and product management for compoun...

   Basic page - 2025-02-13 11:55:03.0

5. MA Qing / 马清

   ... Manager, HR Operation Manager, Deputy HR Director, Vice President a...

   Basic page - 2024-12-04 12:02:51.0

6. Krishna Sreerambhatla

   ... Indian Institute of Technology Delhi. 摘要 / Abstract The silicon car...

   Basic page - 2024-02-20 11:31:47.0

7. Dr.Jing Zhang / 张靖

   ...px; border:0px solid #cccccc; } Dr.Jing Zhang 张靖 Heraeus Materi...

   Basic page - 2024-02-20 10:56:35.0

8. Dr. Fei Wang

   Dr. Fei Wang Professor Shandong Univ...

   Basic page - 2024-02-20 11:30:06.0

9. 章涛

   ...）为代表的化合物半导体高性能晶圆、器件的高新技术企业，公司采用IDM的商业模式，是全球少有同时掌握增强型GaN、耗尽型级联结构以及耗尽型...

   Basic page - 2024-02-23 16:14:03.0

10. Simon Zhang / 张中

    ... JSSI, more than 20 years R&D experience in advanced package are...

    Basic page - 2024-02-29 11:54:01.0