Power & Compound Semiconductor International Forum 2019
Date: Thursday-Friday, March 21-22, 2019
Venue: Pudong Ballroom 4, Shanghai Pudong Kerry Hotel, No.1388 Huamu Road Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "Power & Compound Semiconductor International Forum 2019", which is one of the largest professional event about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2019 on Mar.21-22, 2019 in Kerry Hotel at Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.

SPONSORS

         
         
         
THANKS
         
   
         
Day1-Mar.21st, 2019
   
08:30-09:15 Registration / 注册
   
09:20-09:30
Welcome Remark / 欢迎致辞
Lung Chu 居龙
President, SEMI China
SEMI中国,总裁
   
Opening Keynote Speech / 开幕主旨演讲
   
Moderator/主持人:
Naiqian Zhang 张乃千
President of Dynax Semiconductor, Inc.
苏州能讯高能半导体有限公司,总裁
   
09:30-10:00
Keynote Speech: WBG Market and Technologies
寬禁帶半導體的市場與技術

Andy Chuang 莊淵棋
President, Episil Technologies Inc.
漢磊科技股份有限公司,總經理
   
10:00-10:30
Keynote Speech: Silicon Carbide Materials and Devices for Power Switching Applications
用于功率开关应用的碳化硅材料及器件

John Palmour
CTO, Wolfspeed
Wolfspeed, 首席技术官

   
10:30-11:00
Keynote Speech: Micro LED: Real Revolution for Display Industry
Micro LED: 终极显示技术

Charles Li 李允立
CEO, PlayNitride
錼创科技,首席执行官
   
11:00-11:30
Transforming The Automotive World with Smaller, Lower Cost, More Efficient Power Electronics
Stephen Coates
VP Global Operations, GaN Systems
   
11:30-13:30 Break / 休息
   
*Session: Compound Semiconductor in Optoelectronics, Communications 化合物半导体与光电及5G通讯
   
Moderator/主持人:
Qian Sun 孙钱
Deputy Director, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS
中国科学院苏州纳米技术与纳米仿生研究所,副主任
   
13:30-14:00
Keynote Speech: Using VCSELs in 3D Sensing Applications
用于3D检测的VCSELs技术

Christian Urricariet
Senior Director of Global Marketing, Finisar Corporation
Finisar Corporation, 全球营销高级总监


   
14:00-14:25
An EPI AOI System Based on Deep Learning Algorithm for GaN and GaAs
一种基于深度学习算法用于氮化镓及砷化镓外延片检测的AOI检测系统

Aris Ma 马铁中
CEO, AK Optics Technology Co. Ltd
昂坤视觉(北京)科技有限公司,首席执行官
   
14:25-14:50
From Si to Compound Semiconductor--EPI Technology and Application in Power Electronic Devices
Jun Wu 吴军
Vice President, Naura Technology Group Co., Ltd
北方华创,副总裁
   
14:50-15:15
Compound Semiconductor Power Electronic Devices Manufacturing in Sanan-IC
化合物半导体功率器件制造-三安集成电路

Nien-Tze Yeh 叶念慈
Director of Technology Development, Xiamen Sanan Integrated Circuit Co., Ltd.
厦门三安集成电路有限公司,总监
   
15:15-15:30 Break / 休息
   
Moderator / 主持人:
Nien-Tze Yeh 叶念慈
Director of Technology Development, Xiamen Sanan Integrated Circuit Co., Ltd.
厦门三安集成电路有限公司,总监
   
15:30-15:55
Compound Semiconductor in Wireless Communication: Opportunities & Challenges
化合物半導體於無線通訊之展望與挑戰

Chuck Huang 黃智文
Associate Vice President, Win Semiconductors Corp.
穩懋半導體,協理
   
15:55-16:20
GaN on Si – A Key Enabling Technology for 5G
Markus Behet
CMO, EpiGaN
比利时 EpiGaN公司,首席市场官
   
16:20-16:45
VCSEL Technology and Applications
VCSEL 技术及应用

James Liu
CEO, Ningbo RaySea Technology Inc, Ltd
宁波睿熙科技有限公司,首席执行官


   
16:45-17:10
GaN-A Critical Technology for 5G
氮化镓 – 实现5G的关键技术

James Huang 黄靖
Sr. Manager, Qorvo
Qorvo, 高级销售经理
   
Day2-Mar.22nd, 2019
   
*Session: Wide Band Gap Semiconductors & Emerging Power Devices 宽禁带半导体及新型功率器件
   
Moderator/主持人:
David Xiao 肖国伟
CEO, APT Electronics
广东晶科电子股份有限公司,首席执行官
   
09:30-10:00
Keynote Speech: Compound Semiconductors for Connectivity, Sensing, and Energy
Wayne Johnson
Vice President, IQE
IQE, 副总裁
   
10:00-10:25
From Market Push to Pull – SiC Transistors Are Leaving The Niche
正在走向更广阔市场的碳化硅晶体管

Peter Friedrichs
Senior Director SiC, Infineon Technologies AG
英飞凌科技,高级总监
   
10:25-10:50
High-Voltage Insulated Power Supply and Gate Drive Technology for SiC MOSFETS in Medium/High Voltage Applications
针对于中/高压碳化硅MOSFET应用的高绝缘供电驱动技术

Bill Feng 冯恒毅
Co-Founder, Executive Vice President, Zhejiang DAIJIN Semiconductor Co., Ltd.
浙江大晶磊半导体科技有限公司,共同创办人,执行副总裁
   
10:50-11:15
Advances in Plasma Processing for WBG Power Electronics
先进等离子加工技术在宽禁带半导体功率器件中的应用

Aileen O' Mahony
Product Manager, Oxford Instruments Plasma Technology
英国牛津仪器,产品经理


   
11:15-11:40
Solutions for Wide Bandgap Power & RF Applications
Vincent Meric
Senior Product Manager, AIXTRON SE
德国爱思强股份有限公司,高级产品经理
   
11:40-13:30 Break / 休息
   
Moderator/主持人:
Gan Feng 冯淦
General manager, Epiworld International Co., Ltd
瀚天天成电子科技(厦门)有限公司,总经理
   
13:30-14:00
New Generation High Power Semiconductor Device Introduction
新世代高功率半導體器件介紹

Henry Yeh 葉時豪
General Manager, Bruckewell Technology Corp., Ltd.
Bruckewell Technology Corp., Ltd, 總經理


   
14:00-14:25
Development of Gallium Oxide Power Devices
氧化镓功率器件的进展

Kohei Sasaki
Senior Manager, Novel Crystal Technology, Inc.


   
14:25-14:50
8 Inch GaN-on-Si Power Device Manufacturing : Development and Challenges
八英寸硅基氮化镓功率器件制造: 发展与挑战

HanChin Chiu 邱汉钦
Vice President, Innoscience (Zhuhai) Technology Co., Ltd.
英诺赛科(珠海)科技有限公司,工艺研发副总经理
   
14:50-15:15
Advanced 65nm BCD Offering – Advantages and New Opportunities for Power Management Ics
David Mistele
Section Head of Power Management R&D, Towerjazz
   
15:15-15:45
Closing Keynote
SiC Power Device Technology and Application in Electrified Railway
SiC 功率器件技术及其在电气化轨道交通中的应用

Guoyou Liu 刘国友
Vice Chief Engineer, CRRC Zhuzhou Semiconductor
株洲中车时代电气股份有限公司,副总工程师
   
15:45-16:05 Lucky Draw 幸运抽奖
   
   
Two-day registration fee:
Type Before Feb.20 with Advanced Payment(Early Bird) After Feb.20 and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change


For more information and market promotion opportunities 关于论坛更多信息及市场宣传机会

Daniel QI 戚发鑫
Chief Analyst | Industry Research and Consulting (首席分析师 | 产业研究与咨询部)
Director | Power and Compound Semiconductor Industry; Industry Standards(项目总监 | 功率及化合物半导体产业;产业标准发展)
Tel: 86-21-60278576 ; Email: [email protected]