China Memory Strategic Forum

Date: Friday, March 16, 2018
Venue: Pudong Ballroom 1+2+3, Kerry Hotel Pudong, Shanghai

Attendee Registration  Previous Review

Gartner just released a rough estimate in 2017 for top 10 semiconductor manufacturing company; Samsung surpassed Intel whom was the top candidate for a long time in the industry. Memory takes one third revenue in whole industry incomes with simultaneously rising of volume and price which 17% rising in NAND and 44% in DRAM. Driven by market needs and policy support, 3 new Chinese Memory Companies are speeding up in process development. How shall the multi-national enterprises share the growth of China Memory market? How shall the new players enhance the R&D, and cooperate with global players? Industrial leaders will join the forum to share the insights.

Organizer: Co-organizer:  


     Agenda / 日程:

12:30-13:00 Registration
Andrew Peng
CSO and Vice President of Business Development, Tong Fu Microeletronics Co., Ltd;
Deputy to JEDEC Chairman
Memory Packaging Trends: An Era of Change
E. Jan Vardaman
President of TechSearch International, Inc.
Unleashing MRAM as Persistent Memory
Mustafa Pinarbasi
CTO and Sr. Vice President of Magnetics Technology Spin Transfer Technologies
Overcoming Manufacturing Challenges for Memory Technologies
Harmeet Singh
Corporate Vice President, Lam Research
Equipment and Process Technologies Enabling Advanced Memory Devices
Kaitsuka Takanobu
Director of CTM Device Technology Project Department of TEL
Advanced Memory Packaging Roadmap and OSAT Implications
Scott Sikorski
Vice President of Group Technology Strategy & Product Technology Roadmap for JCET Group
Specialty Memory Market:Build up Eco-system to keep growing
Zhiqiang Su
Marketing strategic director, GigaDevice Semiconductor Inc.
The Development Trend and Breakdown Analysis of Global DRAM Industry in 2018
Ken Kuo
Research Vice President, DRAMeXchange
Agenda is subject to change 议程变化恕不另行通知