SIIP China: SEMI Innovation and Investment Forum

Date: Thursday, March 15, 2018
Venue: Pudong Ballroom 5+6+7, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration  Previous Review

The first 100 paid visitor will have the chance to win Apple Watch! And please be our guest to join the Luck Draw for the Mystery Grand Prize!

The passing 2017 sees the escalating competition and as the Moore’s law approaching its limit, new applications such as cloud computing, big data, IoT and artificial intelligence etc. are surging. The global semiconductor industry is entering a major period of transition and change. Being the biggest integrated circuit consumer market in the world, China has been keeping a two-digit growth these years with manufacturing, design and packaging & test being the three industrial pillars. Competitions on funds, technology, products and talents have been intensifying and the strong demands have vigorously boosted the semiconductor industry.

SIIP China, SEMI Innovation Investment Platform, aims to be one of the most collaborative and influential investment platform for global semiconductor industry by leveraging SEMI global industrial resources, together with global industrial capital and intelligence. SIIP China: SEMI Innovation and Investment Forum, is one of SIIP China’s brand activities held simultaneously with the annual SEMICON China. Besides TIIF, SIIP China series also include China Forums held in San Francisco and Munich along with SEMICON West and SEMICON Europa, respectively. SIIP China will have Delegations to overseas every year as well.

TIIF 2018 will focus on the latest policies, diagnose the current situation of the industry, analyze the capital flows and forecast the future. The AI forum will discuss how semiconductors can promote the innovations and developments of AI and how AI can bring out realistic functions as well as create more intelligent manufacturing and life by means of deep learning, big data & cloud computing, VR /AR. Semiconductor equipment and materials have been the hotspots of the industry and have drawn much the attention. At the second forum in the afternoon, we will have an overview of the investment and merge & acquisitions of this sector and also, look forward to the future for the challenges and opportunities.

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    Agenda / 会议日程:

09:00-09:30 Registration 来宾登记
Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人
Lung Chu
President, SEMI China; Vice President, SEMI
Moderator introduces Speakers 主持人介绍出席嘉宾
Liangsheng, BDA Administrative Commission Director
Keynote Speech 主题演讲
Ding Wenwu
President, China National IC Industry Investment Fund
Chairman, China High-end Integrated Circuits Alliance
Opening Remarks 致辞
Ye Tianchun
Director, Institute of Microelectronics Chinese Academy of Sciences
10:20-10:50 Signing ceremony of MOU between SEMI China and SIIP China partners
SIIP China合作备忘录签约仪式
The Integrated Circuit Industry Technology Innovation Alliance
  Techcode SME Services
Business Cluster Semiconductors Netherlands (BCS)
Shenzhen M&A Association of Listed Companies
Shaanxi Institute of Optoelectronic Integrated Circuit Led Technology
  AM Speeches 嘉宾演讲
Wei Shaojun
Director, Institute of Microelectronics, Tsinghua University
魏少军, 清华大学微电子学研究所所长
Shen Weiguo
Chairman of the Board, Shanghai Integrated Circuit Industry Investment Fund
General Manager, Shanghai S&T Investment Co., Ltd.
Rick Hemond
Chief Marketing Officer, Dow Electronic Materials
11:50-13:30 Lunch break 午休
  PM Sessions
13:30-15:00 Panel Discussion 1 主题论坛1
Topic: Trends and Investment Opportunities in Artificial Intelligence
Wu Ping
President, Summitview Capital
Allen Wu
EVP and President, Arm Greater China
Sean Ding
CTO, IoT BU, Alibaba
Tammy Kiely
Managing Director, Security and Investment Service, Goldman Sachs
Farhan Ahmad
Vice President, Credit Suisse
Christopher Thomas
Managing Partner, Global Digital and Advanced Technology Strategy Practice & Asia Semiconductor Practice, McKinsey & Company, Inc.
15:00–16:30 Panel Discussion 2 主题论坛2
Topic: Semiconductor Supply Chain (Equipment and Materials)
Zhang Guoming
Senior Vice President & Chief Strategy Officer, NAURA
Global Head, Lithography Business, The Dow Chemical Company
丁术季,陶氏化学Lithography Technologies事业部全球总裁
Liu Xinyu
Managing Partner, CGP Techfund
Xu Wei
Secretary of the Party Committee, Executive Vice President, Shanghai Huahong Grace Semiconductor Manufacturing Corporation
Secretary-General of Shanghai Integrated Circuit Industry Association
Wang Hui
CEO & President, ACM Research (Shanghai), Inc.
Li Qing
Managing Director of Suzhou Crystal Clear Chemical Company
16:30–16:40 Lucky Draw (Sponsored by CDICV)
16:40–16:45 Thank you 致谢结束
Agenda is subject to change 议程变化恕不另行通知