SEMICON China - SESSIONS / EVENTS - History-SEMICON China 2015 - Build China’s IC Ecosystem

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Date:Wednesday, March 18, 2015
Venue:Pudong Ballroom 2+3 ,Kerry Hotel ,Pudong, Shanghai

The industrialization of semiconductor started late 70s in the US leading by the IDMs. Driven by the process innovation, specialized equipment and material companies stranded up to the stage. The fabless/foundry model was invented later along with the globalization; Asset-light design houses became primary players in the era of mobile internet leveraging on the speed and flexibility. Industry in China is concentrated in downstream manufacturing, with less connection among one and each. Beneficial from the application market, the growth of domestic fabless annual revenue exceeds 30% recently, to certain extend it mobilizes the development of Foundry, A/T, equipment and material industry. However, due to the limitation on process capability, experience, IP and core material etc., it is unlikely to get everything done within the region therefore cost and time to market are becoming increasing concerns. How to enhance the ecosystem in China, make the chain from design to manufacturing faster, cheaper and more reliable?

In conjunction with the SEMICON China 2015, SEMI China will organize the “Build China's IC Ecosystem Forum". Industry experts from the entire supply chain will come together, discuss about how to enhance and integrate the IC ecosystem in China.

Moderator 魏少军教授
13:30~13:50 SiPaaS – Silicon Platform as a Service
  Wayne  Dai
Chairman, President and CEO, VeriSilicon
13:50~14:10 Building a New Era for China Semiconductor Industry
Sunny Hui
Senior Vice President, Marketing, SMIC
14:10~14:30 发力高端装备,迎接集成电路国产化大时代
  Jinrong Zhao
14:30~14:50 Collaboration for the Sustainable Supply Chain of Semiconductor Industry in China
  Jim White
VP, Supply Chain Operations, Central Procurement Office, Applied Materials
14:50~15:10 Exploration of New Business Model for China’s IC Industry

Michael Chen

PPT Download

15:10~15:30 顺应市场需求,发展先进特色工艺
Andy Liu
Marketing Director, ASMC
15:30~15:50 3D MIS Packaging Technology

Lin YB
MIS Packaging Director/ Marketing VP, JCET


Collaborative Innovation to Build a Brilliant Future

Tony Chen
Vice President of Sales,HHGrace

PPT Download

16:10~17:10    Panel Discussion
  Shaojun Wei , Wayne  Dai,Sunny Hui,Jinrong Zhao,Lin YB,Ningling Wang,Tony Chen
Shaojun Wei
Director, Institute of Microelectronics, Tsinghua University
  Ningling Wang
Managing partner, Finnegan, Henderson, Farabow, Garrett & Dunner, LLP Shanghai office

Mr. Jesse Zhang
Tel: +86-21-60278558
[email protected]

Type Early Bird
(Before Mar.2, 2015)
Registration Fee
(After Mar.2, 2015)
RMB 600/位 RMB 800/位
Speaker Free Free