IC Manufacturing Forum


Date: Friday, June 30, 2023
Time: 09:25-12:10
Venue: Himalayas Ballroom, 6F, Jumeirah Himalayas Hotel Shanghai
Simultaneous Interpretation will be provided.

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IC Manufacturing Forum helps the people and companies of industry chain to grasp the direction of the development of Semiconductor manufacturing, promote the cooperation and common development of the industry chain, "If a worker wants to do his work well, he must first sharpen his tools". In this forum, we will learn about market trends, technology challenges and breakthrough solutions together.

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Agenda / 议程
   
09:00 - 09:25 Registration 来宾登记
   
09:25 - 09:30
Moderator /主持人：
Hui Wang, Chairman, ACM Research(Shanghai), Inc.
王晖，董事长，盛美半导体设备（上海）股份有限公司
   
09:30 - 09:35
 Opening Remarks/开幕致辞
Lung Chu, President, SEMI China; Vice President, SEMI
居龙，SEMI全球副总裁，中国区总裁
   
09:35 - 10:00
 The Development and Solutions of Etching Technology
精雕细刻，刻蚀技术的发展与解决方案
 Wang Na, VP, Beijing NAURA Microelectronics Equipment Co.,Ltd.
王娜，战略发展体系副总裁，北京北方华创微电子装备有限公司
   
10:00 - 10:25
 Positioning and Thinking of China's Semiconductor Equipment Company under the New Situation with the Original Intention and Mission
新形势下中国半导体装备企业的定位与思考
Hui Wang, Chairman, ACM Research(Shanghai), Inc.
王晖，董事长，盛美半导体设备（上海）股份有限公司
   
10:25 - 10:50
 EVG's Advanced Maskless Exposure & NIL Technologies for Next–Generation Devices
EVG先进的无掩模曝光技术&纳米压印技术在新一代器件中的运用
Dr.Ksenija Varga, BD Manager, EV Group E. Thallner GmbH
   
10:50 - 11:15
 AI-and-vision-fusion Solution and Application in Wafer Inspection and Measurement
AI视觉融合解决方案在晶圆量检测中的应用
Duojie Kuai, Technical Scientist, MegaRobo Technologies
蒯多杰，技术科学家，镁伽科技
   
Special Session Components and Sub-System
核心零部件及子系统
   
11:15 - 11:25
 OEM Makes IC Equipment Manufacturing No More Difficult
OEM让IC设备制造不再难
Shen Jian, VP, ULVAC-Suzhou
沈坚，副总经理，爱发科真空技术(苏州)有限公司
   
11:25 - 11:35
 Green and Low-carbon Technologies for Semiconductor Factories
半导体工厂的绿色低碳化技术
The Institute for Zero Carbon Energy, Tokyo Institute of Technology.Special Appointed Professor, Kanken techno Co,.Ltd
森原 淳, 東京工業大学零碳能源研究所, 特聘教授, 日本康肯工程技术有限公司
   
11:35 - 11:50
 Magnetic levitation cutting-edge technology，products and solutions in semiconductor industry
磁悬浮先进技术、产品及在半导体领域解决方案
Chengke, Yin. Ph.D., Founder of Supermag Technology, Standing member of CITA (Chinese International Turbomachinery Alliance)
尹成科，博士，苏磁科技创始人，中国国际透平机械产业联盟常务理事
   
11:50 - 12:00
 Chemical Mechanical Planarization of Interconnects with Advanced Diamond Pad Conditioners
集成电路化学机械平坦化的先进钻石碟
Song Jianmin, Chief scientist, Hebei Jingguo Fuyan New Materials Technology Co., Ltd.
宋健民，首席科学家，河北晶国富研新材料科技有限公司
   
12:00 - 12:10
 Ultrapure Magnetically Bearingless Pumps for Semiconduct Industry
超洁净磁悬浮泵在集成电路制造中的应用
Shao Jiejie, GM, Ningbo Genius Converging Technology Co.,Ltd.
邵杰杰，总经理，宁波众杰来同科技有限公司
   
* 议程以最终版为准
* Please refer to the final version of Agenda.