Distinguished Conference Keynote Speakers

Dr. Martin van den Brink
President and Chief Technology Officer
ASML 		Dr. Gerald Yin
Chairman and CEO
AMEC 		Dr. Marvin Liao
Vice President, APTS
TSMC 		Dr. Feng Hong
CEO
ICLeague Technology


Plenary Session

9:00-12:00, Tuesday, June 14, 2022
Microsoft Teams
Moderator: Dr. Beichao Zhang, AVP, HFC Semiconductor, China
   
9:00-9:35 Opening Ceremony
   
9:00-9:15 Opening Remarks by Conference Chair -Dr Hanming Wu, Academician of Chinese Academy of Engineering, Dean of the School of Micro-nano-Electronics Zhejiang University
9:15-9:20 Opening Remarks by SEMI -Mr. Lung Chu, VP of SEMI and President of SEMI China
9:20-9:27 Presentation of Best Student Paper Awards -Sponsored by Fujifilm and ZJU-Hangzhou Global Scientific and Technological Innovation Center
9:27-9:35 Presentation of Best Young Engineer Paper Awards -Sponsored by Fujifilm and ZJU-Hangzhou Global Scientific and Technological Innovation Center
   
9:35-10:10 Driving Moore's Law into the Next Decade
  Dr. Martin van den Brink
  President and Chief Technology Officer, ASML
   
10:10-10:45 Micro-Fabrication Equipment, the Foundation of Digital Revolution and Beyond
  Dr. Gerald Yin
  Chairman and CEO, AMEC
   
10:45–11:20 Advanced 3D Chiplet Packaging Technology and Manufacturing
  Dr. Marvin Liao
  Vice President, APTS, TSMC
   
11:20–11:55 An Innovative 3D HITOC 4F2 DRAM Architecture
  Dr. Feng Hong
  CEO, ICLeague Technology


Symposium Sessions

Symposium I: Device Engineering and Memory Technology

Symposium II: Lithography and Patterning

Symposium III: Dry & Wet Etch and Cleaning

Symposium IV: Thin Film, Plating and Process Integration

Symposium V: CMP and Post-Polish Cleaning

Symposium VI: Metrology, Reliability and Testing

Symposium VII: Packaging and Assembly

Symposium VIII: MEMS, Sensors and Emerging Semiconductor Technologies

Symposium IX: Design and Automation of Circuits and Systems


Training Course

Workforce Development Development of CMOS Integrated Process