SIIP China: SEMI Innovation and Investment Forum


Date: Thursday, March 18, 2021
Time: 09:00-17:40
Venue: Grand Shanghai Ballroom 3, Kerry Hotel Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

2020 has been an extraordinary year. The impact of epidemic is a big test for the semiconductor industry. The annual SEMI Innovation and Investment Forum during SEMICON is a bellwether for semiconductor investment. We will invite the National IC Industry Investment Fund, 01/02 Special Project leaders, local and industry funds presidents, and enterprise leaders to join speeches and panel discussions. The forum will focus on the economic environment, industry dynamics, the trade friction, opportunities of STAR Market, international cooperation, equipment & materials procurement and spare parts supply chain, cooperation and challenges of semiconductor supply chain, technology hot spots, new infrastructure, IoT. The speakers will discuss changes and opportunities that these hot spots and technologies, and impact on semiconductor industry.

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Agenda / 会议日程:(Tentative agenda and yet to be confirmed 详细日程有待确定)
   
09:00–09:30 Registration 来宾登记
   
09:30–09:35
Welcome Remarks and Introduction of the Moderator 开幕致辞并介绍主持人
Lung Chu
President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
09:35–09:40
Moderator introduces Speakers 主持人介绍出席嘉宾
Liang Sheng
BDA Administrative Commission Director
梁胜,北京经济技术开发区管委会主任
   
09:40–09:50
Keynote Remarks 贵宾致辞
Ding Wenwu
President, China National IC Industry Investment Fund
Chairman, China High-end Integrated Circuits Alliance
丁文武,国家集成电路产业投资基金总裁,中国高端芯片联盟理事长
   
  Signing ceremony of MOU between SEMI China and Merck
SIIP China 与Merck合作备忘录签约仪式
   
  AM Speeches 嘉宾演讲
   
09:50–10:10
Ye Tianchun
Vice Director, China Semiconductor Industry Association
叶甜春,中国半导体行业协会副理事长
   
10:10–10:30
Shen Weiguo
Secretary of the Party Committee\Executive Director\General Manager,Shanghai STVC Group
President, Shanghai Integrated Circuit Industry Investment Fund
沈伟国,上海科技创业投资(集团)有限公司党委书记,执行董事,总经理 ;
上海集成电路产业投资基金董事长
   
10:30–12:00 Panel Discussion 半导体供应链圆桌论坛
Topic: Semiconductor Supply Chain Management
   
  Moderator主持人:
   
  Panelists:
   
Zhang Xin
Senior VP, SMIC; General Manager, SMNC; President, North Integrated Circuit Technology Innovation Center
张昕,中芯国际资深副总裁,中芯北方总经理,北方集成电路技术创新中心董事长
   
Fan Weihong
Vice President/President, Semiconductor Manufacturing Business Headquarters, Silan Microelectronics Co., Ltd.
范伟宏,士兰微电子副董事长/半导体制造事业总部总裁
   
Zhao Jinrong
Chairman of the Board/Chairman of the Executive Committee, NAURA Technology Group Co., Ltd.
赵晋荣,北方华创科技集团股份有限公司董事会董事长、执行委员会主席
   
Zhang Guoming
President, Hwatsing Technology Co., Ltd
张国铭,华海清科总经理
   
Lu Lingzhi
Chairman & CEO, FA Software (Shanghai) Co., Ltd.
吕凌志,上扬软件(上海)有限公司董事长兼首席执行官
   
David Wang
President, ACM Research (Shanghai), Inc.
王晖,盛美半导体设备(上海)股份有限公司董事长
   
Yang Bing Jun
ULVAC(SHANGHAI) TRADING CO.,LTD. CEO
ULVAC RESEARCH CENTER SUZHOU CO., LTD. CEO
杨秉君,爱发科商贸(上海)有限公司 董事总经理
爱发科(苏州)技术研究开发有限公司 董事总经理
   
12:00–12:20
Future of China in Electronics is Positive but with Many Challenges
Handel Jones
CEO, International Business Strategies, Inc.
韩德尔•琼斯,International Business Strategies首席执行官
   
12:20–13:30 Lunch break 午休
   

PM Sessions 下午日程
   
13:30–15:30 Panel Discussion 圆桌论坛
Topic: IC Investment (STAR Market) and International Cooperation
主题:集成电路投资(科创板)与国际合作
   
Moderator主持人:
Zhuo Fumin
Co-Chairman, Shanghai Private Equity Association
卓福民,上海市国际股权投资基金协会联席理事长
   
  Panelists:
   
Lv Houjun
President, GP Capital
Co-Chairman, Shanghai Private Equity Association
吕厚军,金浦投资总裁,上海市国际股权投资基金协会联席理事长
   
Wang Xinchao
Chairman and General Manager of Jiangsu Xinchao Technology Group Co., Ltd.
王新潮,江苏新潮科技集团有限公司董事长兼总经理
   
Daniel Yuan
Co-President, Sino IC Leasing Co., Ltd
President, UNIC Capital Management Co., Ltd
袁以沛,芯鑫融资租赁有限责任公司 轮值总裁, 中青芯鑫资产管理有限责任公司 总裁
   
Adam He
Managing Director, CGP Techfund
何新宇,盛世投资董事总经理
   
Rick Chen
Head of Semiconductor Solutions, Electronics business of Merck, China
陈天牛,默克中国电子科技业务半导体事业部总经理
   
15:30–17:35 Design Innovation Forum - ESDA Session IC设计高峰论坛
   
15:30–15:35
Welcome remarks 欢迎致辞
Lung Chu
President, SEMI China; Vice President, SEMI
居龙,SEMI全球副总裁、中国区总裁
   
15:35– 15:55
Allen Lee
Corporate Vice President, GM of China R&D Center, AMD
李新荣,AMD全球副总裁、中国研发中心总经理
   
15:55– 16:15
Siemens EDA : Enable Design of Silicon to Systems
西门子EDA : 从芯片到系统设计的解决方案

Danny Perng
PacRim Vice President, Siemens EDA
彭启煌,全球资深副总裁及亚太区总裁,西门子EDA
   
16:15– 16:35
Lei MI, PhD
Co-CEO of CASSTAR; XI’AN Institute of Optics and Precision Mechanics of CAS; Executive Director of Shaanxi Institute of Advanced OEIC Technologies;
米磊,中科创星 创始合伙人;陕西光电子集成电路先导技术研究院 执行院长
   
16:35– 16:55
James Huang
Vice President of R&D, Alchip Technologies
黄建棋,世芯电子设计研发副总裁
   
16:55– 17:15
Heterogeneous Integration Technology On Chip Enables IC Advancement in Post Moore Era
单芯片异构系统集成赋能后摩尔定律时代芯片发展
Feng Hong
President /CEO,ICLEAGUE Technology Co.,Ltd
洪沨,芯盟科技有限公司 总裁/首席执行官
   
17:15– 17:35
Mark Ding
CEO,SITRI
丁辉文,上海微技术工业研究院 总经理

   
17:35-17:40
Lucky Draw 幸运抽奖(Apple Watch
   
  Thank you 致谢结束
   
会议议程更新中,以会议现场资料为准。

【Introduction of Electronic System Design Alliance (ESDA)介绍】

In 2018, SEMI completed the integration of Electronic System Design Alliance (ESDA). Consisting of major EDA, IP, and fabless companies, ESDA acts as the central voice to communicate and promote the value of the semiconductor design industry as a vital component of the global electronics industry. The ESDA integration brings key capability and further enhances SEMI’s supply-chain coverage and SEMI’s vertical application platforms such as Smart Transportation, Smart Manufacturing and Smart Data as well as key enabling technologies including AI, 5G, and Machine Learning.

2018年SEMI完成了对于ESDA的合并。多年以来,ESDA不遗余力推动半导体设计业的价值, 并成为促进全球电子产业进步至关重要的一关键技术。ESDA的加入使得SEMI如虎添翼,SEMI所覆盖的产业供应链,及SEMI致力推动的垂直应用平台以及核心技术都由此得以延展和加强,涵盖了智能交通、智能制造、智能数据、AI、5G以及机器学习等方方面面。