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March 17-19, 2021
Shanghai New International Expo Centre

Power & Compound Semiconductor International Forum 2020

Power & Compound Semiconductor International Forum 2020
Date: Sunday-Monday, June 28-29, 2020
Venue: Pudong Ballroom 4, Shanghai Pudong Kerry Hotel, No.1388 Huamu Road Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

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The "Power & Compound Semiconductor International Forum 2020", which is one of the largest professional event about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2020 on June 28-29, 2020 in Kerry Hotel at Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.

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Outstanding Speakers of 2020

Tong Chen Weiwei Luo Song Bai Kai Cheng Xiaochi Chen
Global Power Innoscience Zhongdian Guoji Enkris Vertilite
CEO Board Chair Professor Board Chair General Manager

Lucky Attendees of 2020 Survey

陈* mobile: ****4720
王* mobile: ****5533
肖*凡 mobile: ****6340
魏*夫 mobile: ****1035
易*军 mobile: ****8692
   
Day1-June 28th, 2020
   
08:30-09:15 Registration/注册
   
09:20-09:30
Welcome Remark/欢迎致辞
Lung Chu 居龙
President, SEMI China
SEMI中国,总裁
   
Opening Keynote Session / 开幕主旨演讲
   
Moderator/主持人:
David Xiao 肖国伟
CEO, APT Electronics
首席执行官,广东晶科电子股份有限公司
   
09:30-10:00
硅基氮化镓产业发展“芯”机遇
Weiwei Luo 骆薇薇
Board Chair, Innoscience (Zhuhai) Technology Co., Ltd.
董事长,英诺赛科(珠海)科技有限公司
   
10:00-10:30
GaN is Driving Changes in Automotive Systems (Virtual)
氮化镓技术如何推动车载系统的发展进程(Virtual)

Alex Lidow
CEO and Co-founder, Efficient Power Conversion Corporation
首席执行官兼联合创始人,美国宜普电源转换公司
   
10:30-11:00
How Cheap SiC Solution Can Be in The Near Future
碳化硅应用方案可以做到多便宜

Tong Chen 陈彤
CEO, Global Power Technology Co., Ltd.
总经理,泰科天润半导体科技(北京)有限公司
   
11:00-11:30
Enabling Solutions for High Volume Manufacturing of Wide Bandgap Materials
用于宽禁带半导体材料大规模生产的解决方案

Ziwen Fang 方子文
Senior Department Manager, AIXTRON SE
高级部门经理,德国爱思强股份有限公司
   
11:30-13:30 Break (休息)
   
Moderator/主持人:
Jiangbo Wang 王江波
VP, HC SemiTek Corporation
副总裁, 华灿光电(浙江)有限公司
   
13:30-14:00
Toward for Ultimate Displays with MicroLED (Virtual)
迈向终极显示技术 – MicroLED (Virtual)

Yun-Li (Charles) Li 李允立
CEO, PlayNitride
首席执行官,錼创科技
   
Session: Compound Semiconductor in Optoelectronics, Communications 化合物半导体与光电及5G通讯
   
14:00-14:30
VCSELs and ToF Modules for 3D Sensing
用于三维传感的VCSEL和ToF模块

Xiaochi Chen 陈晓迟
General Manager, Vertilite Co., Ltd
总经理,常州纵慧芯光半导体科技有限公司
   
14:30-15:00
Application of Compound Semiconductor in Millimeter Wave Communication
化合物半导体的毫米波通信应用

Chunjiang Li 李春江
Vice General Manager, Chengdu HiWafer Semiconductor Co., Ltd.
副总经理,成都海威华芯科技有限公司
   
   
15:00-15:30
NAURA Solutions for Si Epitaxy and SiC Growth Applied for Power Devices (Virtual)
NAURA 的Si外延和SiC材料在功率器件领域的解决方案(Virtual)

Boyu Dong 董博宇
Vice president&CVD Business Unit General Manager, Beijing NAURA Microelectronics Equipment Co.,Ltd
副总裁兼CVD事业部总经理,北京北方华创微电子装备有限公司
   
15:30-16:00
Advanced Plasma Processing Solutions for High Performance VCSELs Focussing on Cost Down Per Wafer and Critical Device Performance
先进等离子加工技术于高性能VCSEL和EEL的解决方案:特征蚀刻和薄膜沉积。降低晶圆成本及关键设备性能

Terry Chen
China Country Manager, Oxford Instruments Plasma Technology
中国区经理,英国牛津仪器
   
16:00-16:30
GaN- A Key Technology for 5G
实现5G的关键技术-GaN

Jenny Xun 荀颖
FAE manager, Qorvo
Qorvo
   
   
Day2-June 29th, 2020
   
Session: Wide Band Gap Semiconductors & Emerging Power Devices 宽禁带半导体及新型功率器件
   
Moderator/主持人:
Qian Sun 孙钱
Deputy Director, Suzhou Institute of Nano-Tech and Nano-Bionics (SINANO), CAS
副主任,中国科学院苏州纳米技术与纳米仿生研究所
   
09:00-09:30
Opening Keynote Speech: Latest Packaging Developments Enhance Performance of Silicon Carbide (SiC) Power Devices (Virtual)
用于加强碳化硅功率器件性能的最新封装技术 (Virtual)

Filippo Di Giovanni
STMicroelectronics
意法半导体
   
09:30-10:00
Technical Problems and Research Progress of SiC Power MOSFET
碳化硅功率MOSFET技术问题及研究进展

Song Bai 柏松
Professor, Zhongdian Guoji South Co. , Ltd.
教授级高工,中电国基南方有限公司
   
10:00-10:30
Progress on GaN Epitaxial Technology for New Devices
用于新型器件的GaN外延技术

Kai Cheng 程凯
Board Chair, Enkris Semiconductor, Inc.
董事长,苏州晶湛半导体有限公司
   
10:30-11:00
Recent Advances of ALD Technology for Power & Compound Semiconductor Applications - A Prospect of Innovation and Localization in China
原子层沉积技术在功率及化合物半导体的应用及国产化创新的展望

Wei-Min Li 黎微明
CTO, Jiangsu Leadmicro Nano Technology Co.,Ltd.
首席技术官,江苏微导纳米股份有限公司
   
11:00-11:30
Advances in PVD Techniques for SiC and GaN Power Devices
应用于碳化硅和氮化镓功率器件的PVD技术的进步

Michael Yi 易义军
SPTS Technologies
   
11:30-12:00
ON Semiconductor SiC Solutions for Communications, Electric Vehicles and Solar Inverters
安森美半导体碳化硅(SIC)方案服务于通信、电动汽车、太阳能逆变器等市场

Raymond Wang 王利民
Product Marketing Manager, ON Semiconductor
安森美半导体
   
12:00-13:30 Break (休息)
   
Moderator/主持人:
Shunfeng Li 李顺峰
Chief Scientist of Wide Band Gap Materials, CR MICRO
宽禁带材料首席专家, 华润微电子控股有限公司
   
13:30-13:55
Navitas GaN Power ICs Drive Fast Charger Innovation and Market Adoption
纳微高集成氮化镓功率芯片推动快充技术和市场的革新

Charles Zha 查莹杰
VP, General Manager of China, Navitas Semiconductor
副总裁,中国区总经理,纳微半导体
   
13:55-14:20
High Volume Manufacturing of Power Technologies (Virtual)
功率技术的高产能制造(Virtual)

Dustin Ho 何文彬
Technical Director, Silicon Product Group, Applied Materials, Inc
半导体产品事业部技术总监,应用材料公司
   
14:20-14:45
Progress in Study and Industrialization of Wide Bandgap Semiconductor SiC Substrate
宽禁带半导体碳化硅衬底研究和产业进展

Chunjun Liu 刘春俊
Vice President, CTO, TankeBlue Semiconductor Co., Ltd.
副总经理、技术总监,北京天科合达半导体股份有限公司
   
14:45-15:10
Smart Integrations Maximizes the Performance of GaN Switches – Addressing the Challenge of Driving GaN
智能集成最大化地提升了氮化镓开关性能-谈谈驱动氮化镓面临的挑战

Ye Xu 徐晔
Power Integrations, Inc.
   
15:10-15:35
Development of High Power SiC Power Modules for NEV and Traction Application (Virtual)
用于新能源汽车和牵引应用的大功率SiC功率模块开发(Virtual)

Allen Wang 王浩
Technical Support Specialist, ABB China
技术支持专家,ABB中国
   
15:35-16:00
Closing Keynote: 200mm/8-inch GaN Power Device and GaN-IC Technology: A New Opportunity for Wafer Suppliers, Foundries and IDMs (Virtual)
8英寸GaN功率器件及IC技术:晶圆供应商、代工厂、IDM厂商的新机遇 (Virtual)

Denis Marcon
IMEC
   
16:00-16:20 Lucky Draw 幸运抽奖
   
   
Two-day registration fee:
Type Before June 5th with Advanced Payment(Early Bird) After June 5th and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change