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June 27-29, 2020
Shanghai New International Expo Centre

Power & Compound Semiconductor International Forum

Power & Compound Semiconductor International Forum
Date: Sunday-Monday, June 28-29, 2020
Venue: Pudong Ballroom 4, Shanghai Pudong Kerry Hotel, No.1388 Huamu Road Pudong, Shanghai
Chinese and English Simultaneous Interpretation will be provided

Attendee Registration   Previous Review

The "Power & Compound Semiconductor International Forum 2020", which is one of the largest professional event about power and compound semiconductor industry in Asia, will be organized in conjunction with SEMICON China 2020 on June 28-29, 2020 in Kerry Hotel at Shanghai.
The Forum is a two-day program and focuses on topics including: Wide Band Gap Power Electronics, Optoelectronics, Compound Semiconductor in Communications, and Emerging Power Device Technology.

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Day1-June 28th, 2020
   
08:30-09:15 Registration/注册
   
09:20-09:30
Welcome Remark/欢迎致辞
Lung Chu 居龙
President, SEMI China
SEMI中国,总裁
   
09:30-11:30 Opening Keynote Session / 开幕主旨演讲
   
Moderator/主持人:
Naiqian Zhang 张乃千
President of Dynax Semiconductor, Inc.
总裁,苏州能讯高能半导体有限公司
   
Compound Semiconductors - Unleashing the Power
大放异彩的化合物半导体

Drew Nelson
CEO, IQE
首席执行官, IQE
   
8 Inch GaN-on-Si Power Device Manufacturing: Development and Challenges
八英寸硅基氮化镓功率器件制造: 发展与挑战

Weiwei Luo 骆薇薇
Board Chair, Innoscience (Zhuhai) Technology Co., Ltd.
董事长,英诺赛科(珠海)科技有限公司
   
Application of SiC Devices in New Energy Vehicles (Pending)
碳化硅器件在新能源汽车领域的应用(拟)

Tong Chen 陈彤
CEO, Global Power Technology Co., Ltd.
总经理,泰科天润半导体科技(北京)有限公司
   
GaN for Cars (Virtual)
用于现代交通的氮化镓技术(Virtual)

Alex Lidow
CEO and Co-founder, Efficient Power Conversion Corporation
首席执行官兼联合创始人,美国宜普电源
   
Toward for Ultimate Displays with MicroLED
迈向终极显示技术 -- MicroLED

Yun-Li (Charles) Li 李允立
CEO, PlayNitride
首席执行官,錼创科技
   
Enabling Solutions for High Volume Manufacturing of Wide Bandgap Materials
用于宽禁带半导体材料大规模生产的解决方案

Ziwen Fang 方子文
Senior Department Manager, AIXTRON SE
德国爱思强股份有限公司
   
11:30-13:30 Break (休息)
   
13:30-14:00
Latest Packaging Developments Enhance Performance of Silicon Carbide (SiC) Power Devices
用于加强碳化硅功率器件性能的最新封装技术

Filippo Di Giovanni
STMicroelectronics
意法半导体
   
Session: Compound Semiconductor in Optoelectronics, Communications 化合物半导体与光电及5G通讯
   
14:00-14:30
VCSELs and ToF Modules for 3D Sensing
用于三维传感的VCSEL和ToF模块

Xiaochi Chen 陈晓迟
General Manager, Vertilite Co., Ltd
总经理,常州纵慧芯光半导体科技有限公司
   
14:30-15:00
GaN- A Key Technology for 5G
实现5G的关键技术-GaN

James Huang 黄靖
Sales director, Qorvo
Qorvo
   
   
15:00-15:30
From Si to Compound Semiconductor--EPI Technology and Application in Power Electronic Devices
从硅基到化合物半导体 - EPI技术及其在电力电子器件中的应用

Naura
北方华创
Speaker TBD
   
15:30-16:00
Advanced Plasma Processing Solutions for High Performance VCSELs and EELs: Feature Etching and Thin Film Deposition. Enabling Cost Down Per Wafer and Critical Device Performance
先进等离子加工技术于高性能VCSEL和EEL的解决方案:特征蚀刻和薄膜沉积。降低晶圆成本及关键设备性能

Robert Gunn
Senior Product Manager – Etch, Oxford Instruments Plasma Technology
蚀刻机高级产品经理,英国牛津仪器
   
16:00-16:30
RF GaN Technology Solutions for 5G
适用于5G的射频氮化镓技术解决方案

Markus Behet
CMO, EpiGaN / Soitec
首席市场官
   
   
Day2-June 29th, 2020
   
Session: Wide Band Gap Semiconductors & Emerging Power Devices 宽禁带半导体及新型功率器件
   
Moderator/主持人:
David Xiao 肖国伟
CEO, APT Electronics
首席执行官,广东晶科电子股份有限公司
   
09:30-09:55
Technical Problems and Research Progress of SiC Power MOSFET
碳化硅功率MOSFET技术问题及研究进展

Song Bai 柏松
Professor, Zhongdian Guoji South Co. , Ltd.
教授级高工,中电国基南方有限公司
   
09:55-10:20
Progress in Study and Industrialization of Wide Bandgap Semiconductor SiC Substrate
宽禁带半导体碳化硅衬底研究和产业进展

Chunjun Liu 刘春俊
Vice President, CTO, TankeBlue Semiconductor Co., Ltd.
副总经理、技术总监,北京天科合达半导体股份有限公司
   
10:20-10:45
Recent Advances of ALD Technology for Power & Compound Semiconductor Applications - A Prospect of Innovation and Localization in China
原子层沉积技术在功率及化合物半导体的应用及国产化创新的展望

Wei-Min Li 黎微明
CTO, Jiangsu Leadmicro Nano Technology Co.,Ltd.
首席技术官,江苏微导纳米股份有限公司
   
10:45-11:10
Advances in PVD Techniques for SiC and GaN Power Devices
应用于碳化硅和氮化镓功率器件的PVD技术的进步

Michael Yi
SPTS Technologies
   
11:10-11:35
ON Semiconductor SiC Solutions for Communications, Electric Vehicles and Solar Inverters
安森美半导体碳化硅(SIC)方案服务于通信、电动汽车、太阳能逆变器等市场

Raymond Wang 王利民
Product Marketing Manager, ON Semiconductor
安森美半导体
   
11:35-12:00
200mm/8-inch GaN Power Device and GaN-IC Technology: A New Opportunity for Wafer Suppliers, Foundries and IDMs
8英寸GaN功率器件及IC技术:晶圆供应商、代工厂、IDM厂商的新机遇

Denis Marcon
IMEC
   
12:00-13:30 Break (休息)
   
Moderator/主持人:
Filippo Di Giovanni
STMicroelectronics
意法半导体
   
13:30-14:00
Challenges of Driving Wide-Bandgap Semiconductors and The Use of Smart Integration to Maximize The Performance of GAN Switches
用于氮化镓器件优化的智能集成及宽禁带半导体之挑战

Ye Xu 徐晔
Power Integrations, Inc.
   
14:00-14:25
Development of High Power SiC Power Modules for NEV and Traction Application
用于新能源汽车和牵引应用的大功率SiC功率模块开发

Makan Chen 陈马看
Senior Technical Sales Manage, ABB Switzerland Ltd
高级技术销售经理, ABB 瑞士
   
14:25-14:50 TBD (Speech Reveserd)
   
14:50-15:15
Advanced High Voltage Bulk & SOI Technologies for Smart Power Applications
适用于智能电源应用的高级高压本体和SOI技术

Dr. Hongning Yang
Tower Semiconductor Principal Engineer, Power Management Group
首席工程师
   
15:15-15:35 Lucky Draw 幸运抽奖
   
   
Two-day registration fee:
Type Before June 5th with Advanced Payment(Early Bird) After June 5th and On-site
Attendees RMB 1,000 per person RMB 1,500 per person
Speakers Free Free
* Lunch is not included
* Agenda is subject to change