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Date:Tuesday, March 17, 2015
Time:13:30-17:30
Venue: Pudong Ballroom 2+3 ,Kerry Hotel ,Pudong, Shanghai



It has become the Era of Mobile Internet to the Semiconductor industry since smart phone replaced PC to be the market driving force. Human to human, human to device and device to device computing and communication are everywhere. Handset, the wearable, automobile and IOT, one after another, step into our vision and rebuild our life style. SEMI China will organize the "Advanced Packaging Forum", where industry elites sit together to discuss the technology and solution for the Era of Mobile Internet.

From the market trend to product application, in conjunction with various assembly and test technology, creative equipment and material, together we map a new blueprint of the industry.

 

Moderator 
 

Huili Fu, chief IC packaging expert and department director of Packaging Engineering Dept, Huawei (Hisilicon Semiconductor)

  
13:30~13:55IoT Related Packaging Solutions - 2.5D / 3DIC enabling New Wave SiPs
Walter Jau, Director,  Corporate R&D, ASE Group
  
13:55~14:20JCET Low Cost Packaging Solution

Anderson Bao,
Director of Technology, Engineering and R&D Center, JCET


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14:20~14:45Next generation package solutions for mobile and IoT devices
 Chang-Yi (Albert) Lan
Senior Director, Engineering Center  Siliconware Precision Industries Co., Ltd. (SPIL)
  
14:45~15:10A temporary bonding and debonding technology for TSV fabrication
 

MASAHIRO YAMAMOTO, Manager of TEL 3DI DEPT 
Xiaowei Cheng, Account manager of TEL China

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15:10~15:35磁控溅射物理气相沉积在先进封装中的应用
丁培军
北方微电子副总裁
  
15:35~16:00晶圆级封装的优势及劣势

万里兮
华天昆山总工程师

  
16:00~16:25Enabling Multi-Die Integration Through Advanced Packaging
Sesh Ramaswami
Managing Director, Packaging Technologies, Silicon Systems Group, Applied Materials
  
16:25~17:25Panel Discussion
The Advanced Packaging Technology Demand and Challenge of Mobile Communication and IoT
 

符会利, Jim Xu, Walter Jau, 包旭升, 藍章益, 丁培军

Jim Xu
Chief Technical Officer, Zeta Instruments

 
  
17:25~17:30Lucky draw for five gifts 

 

Mr. Jesse Zhang
Tel: +86-21-60278558
Email:
[email protected]

TypeEarly Bird
(Before Mar.2, 2015)
Registration Fee
(After Mar.2, 2015)
RMB 600/位RMB 800/位
SpeakerFreeFree